Abstract:The investigation on the machining damage evolution and material removal mechanism of anisotropic brittle material is of vital interest for controlling surface and subsurface damage. In this work, with the combination of stress field analysis and scratching experiments, the evolution of various cracks and the mechanism of material removal in the scratching process of anisotropic brittle material were decoupled to determine the inducing conditions and coupling modes of different cracks. Firstly, an improved elastic stress field model was established considering anisotropy characteristics, tool shape, and material elastic recovery. Furthermore, the scratching experiments of single crystal silicon with varying crystal orientations were carried out. Finally, the characteristics of subsurface damage were analyzed by transmission electron microscopy, and the interaction between dislocation and crack was investigated. The results show that the lateral crack first initiates and propagates on the material subsurface under the tensile stress behind the tool. With the influence of the cleavage surface, radial cracks gradually form on the material surface. Median cracks induced by the tensile stress initiated at the front of the tool. The geometric overlap of the opening radial crack and lateral crack resulting in brittle removal in the form of massive brittle stripping. The theoretical results agreed well with the experimental results, the average error of prediction of radial crack propagation direction is less than 9.4%. There is a strong crystal orientation dependence in the damage evolution process. The scratching of crystal orientation [100] is more conducive to the ductile machining due to its lower elastic stress and higher dislocation density. This research contributes to a deeper comprehension of the damage evolution and the crystal orientation dependence of anisotropic brittle material.

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