Abstract:In electronic packaging industry, it has been reported that compared with nano silver and nano copper, the complementation and coordination of Ag and Cu components enable bimetallic nanomaterials enhanced anti-electromigration and oxidation inhibition characteristics. Ag-Cu solid solution nanoparticles (ACDS NPs) has become an emerging substitution and garnered widespread attention. This research presents the investigation into the size-dependent melting behaviour of ACDS NPs and the effect of elevated temperature during the pressure-free sintering with Ag substrate through molecular dynamics simulations. The melting points of ACDS NPs turn out to be in accordance with Gibbs Thomson equation, based on which the suitable sintering temperatures have been determined within 473 and 773 K. As demonstrated by dynamic trajectories at cross section while sintering, coalescence between NPs occurs with the atomic surface diffusion at the sintering neck along the vacancy concentration gradient. 623 K is estimated to be a threshold temperature of complete integration of NPs at which the crystallographic structure collapses during sintering and recrystallizes at the late sintering stage. The dominant sintering mechanisms transferred from surface diffusion and dislocation-based plastic deformation below 573 K to atomic diffusion above 623 K. Furthermore, the results present incontrovertible dominance of Shockley dislocations and interaction energy on determining mechanical properties of sintered atomistic system. It is also revealed that the systems sintered below 673 K yield significantly lower thermal conductivity attributing to the strong localization of heat carriers for intrinsic amorphous structure than crystalline counterparts above 723 K.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

The Effect of A Small Amount of Tungsten on the Microstructure of Mechanically Alloyed Ag37cu63

Reactive diffusion at the interface between Cu and Sn–Ag alloys

Effect of Ag Doping on Mechanical Properties of Cu6Sn5 Intermetallic Compounds

Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Interface Structure Between Ag Precipitates and Cu Matrix and Its Effect on the Properties of the Cu-Ag Alloy

Influences of Metal Oxide Additions on the Morphology of Sintered AgSnO2 Composite Powders

Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5

Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints

Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Mechanism of Ag and Al on improving the glass forming ability of CuZr-based alloys

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System

Interfacial reactions in Ag-Sn/Cu couples

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys

Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate

The Effect of Cu:Ag Atomic Ratio on the Properties of Sputtered Cu–Ag Alloy Thin Films

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate