Abstract:Abstract With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming more and more critical. Because conventional mechanical polishing methods inevitably produce scratches of the same size as the device in metal or even dielectric layers, resulting in depth of field and focus problems in lithography. The first planarization technique to achieve application is spin on glass (SOG) technology. However, this technology will not only introduce new material layers, but will also fail to achieve the global flattening required by VLSI and ULSI technologies. Moreover, the process instability and uniformity during spin coating do not meet the high flatness requirements of the wafer surface. Also, while some techniques such as reverse etching and glass reflow can achieve submicron level regional planarization. After the critical dimension reaches 0.35 microns (sub-micron process), the above methods cannot meet the requirements of lithography and interconnect fabrication. In the 1980s, IBM first introduced the chemical mechanical polishing (CMP) technology used to manufacture precision optical instruments into its DRAM manufacturing [1]. With the development of technology nodes and critical dimensions, CMP technology has been widely used in the Front End Of Line (FEOL) and Back End Of Line (BEOL) processes [2]. Since the invention of chemical mechanical polishing, scientists have not stopped studying its internal mechanism. From the earliest Preston Formula (1927) to today’s wafer scale, chip scale, polishing pad contact, polishing pad - abrasive - wafer contact and material removal models, there are five different scale models from macro to the micro [3]. Many research methods, such as contact mechanics, multiphase flow kinetics, chemical reaction kinetics, molecular dynamics, etc., have been applied to explain the principles of chemical mechanical polishing to establish models. This paper mainly introduces and summarizes the different models of chemical mechanical polishing technology. The various application scenarios and advantages and dis-advantages of the model are discussed, and the development of modeling technology is introduced.

A review of techniques for polishing and planarizing chemically vapor-deposited (CVD) diamond films and substrates

A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing

Polishing and planarization of single crystal diamonds: state-of-the-art and perspectives

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

Roughness Control in the Processing of 2-Inch Polycrystalline Diamond Films on 4H-Sic Wafers

Polishing of {100} and {111} single crystal diamond through the use of Chemical Mechanical Polishing

Optical Quality Laser Polishing of CVD Diamond by UV Pulsed Laser Irradiation

CVD diamond processing tools: A review

Fracture Strength and Toughness of Chemical-Vapor-deposited Polycrystalline Diamond Films

Review on modeling and application of chemical mechanical polishing

Failure Mechanisms of Cvd Diamond Wafers and Thin Films During Polishing

Approach: developing nano/sub-micron diamond slurry technology for enhanced precision polishing of optoelectronic materials

Chemical vapour deposition synthetic diamond: materials, technology and applications

Polishing Approaches at Atomic and Close-to-Atomic Scale

Control of surface and bulk crystalline quality in single crystal diamond grown by chemical vapour deposition

Engineered CVD Diamond Coatings for Machining and Tribological Applications

Novel surface characteristics observed during grinding of polycrystalline diamond

A novel slurry for chemical mechanical polishing of single crystal diamond

Damage-free highly efficient plasma-assisted polishing of a 20-mm square large mosaic single crystal diamond substrate

Review on chemical mechanical polishing for atomic surfaces using advanced rare earth abrasives

Progress and prospect of diamond dynamic friction polishing technology