Moisture characteristics of wafer level compression molding compounds

Xiaowu Zhang,R. Rajoo

DOI: https://doi.org/10.1109/EPTC.2011.6184404

2011-12-01

Abstract:This paper presents moisture characteristics of 10 wafer level compression molding compounds manufactured by 6 leading manufacturers. Moisture absorption test were conducted on 4 liquid and 6 granular compression molding compound. The samples were subjected to 85°C/85% and 60°C/60% relative humidity soaking for 1376hrs till saturation. Moisture absorption weight gain and diffusion coefficient at different temperature and different humidity are characterized. Molding compounds are hydrophilic and absorbs moisture when exposed to a humid environment during packaging, transportation and storage. Absorbed moisture in the mold compounds resulting in water molecules can induce stresses resulted hygroscopic swelling which can lead to cracking and popcorn failure of electronics package during solder reflow process or swelling-induce damage during life long service period under various field environmental conditions. Failure of electronics package can also occur due to electrochemical migration in the presence of electrical bias and moisture. Liquid and granular are forms of wafer level compression molding materials are being manufactured and explored by electronics packaging industry for Embedded device wafer level packaging based on wafer level molded and reconfiguration. Wafer level molding also being carried in chip-to-wafer to realize 3D-IC packaging using Through Silicon Via (TSV) technology. With the new molding compound, developed to meet requirements of the design and reliability of next generation electronics package or systems, it becomes increasingly important to characterize moisture absorption behavior and characteristics.

Engineering,Materials Science