Recent advances in the study of moisture absorption in plastic electronic packaging

Junlong BIE,Xuewei SUN,Songliang JIA

DOI: https://doi.org/10.3321/j.issn:1000-0992.2007.01.008

2007-01-01

Abstract:The polymers commonly used in plastic electronic packaging are apt to absorb moisture in the environment, which greatly affects the reliability of packages. In this article the studies on moisture diffusion process, hygroscopic stresses and moisture-induced vapor pressure are reviewed, with the emphasis on the theoretical analysis, parameter characterization and its experimental measurement and validation, as well as the finite element simulation. Based on the mechanism analysis and experimental results, it can be seen that moisture absorption of polymer materials in plastic packages can degrade its reliability significantly. More and more researches are focused on the study of moisture absorption, diffusion and evaporation processes, and on the experimental methods to measure and characterize the above processes.