Conditioning a Copper Cathode Surface by High-Voltage Subnanosecond Pulses

Yuriy I. Mamontov,Yuriy A. Zemskov,Igor V. Uimanov,Sergey V. Barakhvostov,Alexander I. Lipchak,Sergey A. Barengolts

DOI: https://doi.org/10.1109/tps.2024.3374898

IF: 1.368

2024-01-01

IEEE Transactions on Plasma Science

Abstract:Within the article, a preeroded copper cathode was subjected to the impact of a series of high-voltage pulses with a duration of $<$ 1 ns for surface conditioning. An effective cathode surface area was $\sim$ 0.01 mm $^{2}$ . Preerosion of the cathode surface was performed using a series of vacuum arc discharges of microsecond duration. As a result, a well-pronounced microrelief with a typical dimension of $\sim$ 5–10 $\mu $ m was formed at the cathode surface. Then, to smooth the microrelief, the cathode was placed into a vacuum setup based on a RADAN pulse generator with a pulse duration of $<$ 1 ns and a pulse amplitude of up to $-$ 140 kV. About 900 discharges of a subnanosecond duration were initiated. To estimate the conditioning effectiveness, the state of the cathode surface was controlled by studying the cathode field-emission characteristics and cathode surface imaging by scanning electron microscopy (SEM). The field-emission characteristic study made it possible to estimate the electric field enhancement factor $\beta $ near the cathode surface before and after the conditioning. It was shown that the subnanosecond conditioning led to a decrease in $\beta $ by a factor of 6–8 from $\sim$ 170 after eroding to $\sim$ 20–30. Employing SEM investigation of the sample surface morphology, it was found that a typical microrelief dimension was decreased from $\sim$ 5–10 to $\sim$ 1–2 $\mu $ m or less. That is, a proposed conditioning technique allowed significant smoothing of the cathode surface.

physics, fluids & plasmas