Abstract:The application of microwave hybrid heating (MHH) technique in low-temperature joining presents a notable benefit of delivering both selective and uniform heating, a characteristic that is not typically found in traditional welding techniques. This experimental investigation aimed to evaluate the reliability of joints under a uniform temperature condition compared to those formed through the reflow soldering method. The present study successfully achieved joint formation through the utilization of the reflow soldering technique, utilizing a maximum temperature of 250 °C and a reflow time of 600 s. EBSD characterization , revealed the occurrence of recovery and recrystallization at the joint. Moreover, as the duration of aging increases, the crystallographic orientation of Sn and Cu 6 Sn 5 becomes more prominent, with Cu 6 Sn 5 exhibiting growth predominantly along a specific direction [0 0 1]. In addition, the MHH technique was employed, using specific parameters of 900 W and 195 s, to achieve successful joint production. Empirical findings revealed that reflow joints saw a significant drop of 34.2 % in their shear strength after being aged for 7 days. Likewise, the shear strength of MHH joints decreased by 28.9 % under the same aging conditions. During the aging process spanning 21–28 days, the decrease in shear strength proportion gradually diminishes. More precisely, the reflow soldering head experiences a reduction of merely 7.6 %, while MHH demonstrates a decrease of only 2.5 %. The joint's fracture pattern shifted from primarily ductile to a combination of mixed fracture after a duration of 28 days for both soldering methods, which contrasts with the previously observed timeframe of 7–21 days.

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Grain Orientations and Failure Mechanism of Isothermal Aged Nano Sn-3Ag-0.5Cu/Cu Solder Joints by Microwave Hybrid Heating and Shear Mechanical Strength

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