Quasi-isostructural Alloying of Cu 2 SnSe 3 –Cu 3 SbSe 4 toward Higher Thermoelectric Performance
Yuting Fan,Sen Xie,Jinchang Sun,Xinfeng Tang,Gangjian Tan
DOI: https://doi.org/10.1021/acsaem.1c01155
IF: 6.4
2021-06-01
ACS Applied Energy Materials
Abstract:Isostructural alloying has been regarded as an important approach to boosting thermoelectric performance of narrow gap semiconductors through thermal conductivity reduction. However, it does harm to carrier mobilities as well because of atomic disorders. Here, we extend the alloying concept from "isostructural" to "quasi-isostructural", which means that the two alloying components are no longer strictly isostructural but structurally closely related. As a proof-of-concept, a series of cubic Cu<sub>2</sub>SnSe<sub>3</sub>–tetragonal Cu<sub>3</sub>SbSe<sub>4</sub> quasi-isostructural alloys (Cu<sub>2+<i>x</i></sub>Sn<sub>1–<i>x</i></sub>Sb<sub><i>x</i></sub>Se<sub>3+<i>x</i></sub>) were synthesized, and their thermoelectric transport properties were systematically studied. No significant loss of carrier mobilities was found during quasi-isostructural alloying, probably due to the structural similarity of the two end members as well as the negligible mass contrasts between Sn and Sb. Surprisingly, a remarkable reduction of lattice thermal conductivity from 1.2 W m<sup>–1</sup> K<sup>–1</sup> for Cu<sub>2</sub>SnSe<sub>3</sub>/Cu<sub>3</sub>SbSe<sub>4</sub> to 0.4 W m<sup>–1</sup> K<sup>–1</sup> for Cu<sub>5</sub>SnSbSe<sub>7</sub> at 673 K was observed, which can hardly be explained from a solid solution perspective. Our X-ray photoelectron spectroscopy analysis unambiguously demonstrate the coexistence of Sn<sup>2+</sup> and Sn<sup>4+</sup> in the alloying systems, whereas Sn simply exhibits Sn<sup>4+</sup> in Cu<sub>2</sub>SnSe<sub>3</sub>. We deduce that the minute structural changes of Cu<sub>2</sub>SnSe<sub>3</sub> during quasi-isostructural alloying make Sn discordant, leading to its valence state splitting. The mixed-valence scattering therefore strongly impedes phonon propagation beyond alloying. Altogether, a considerably enhanced <i>ZT</i> ≈ 0.4 is realized in the sample with <i>x</i> = 0.2, which is 150% improvement over the <i>x</i> = 0 sample. By selecting the <i>x</i> = 0.5 sample as a representative, a preliminary doping study was performed but seems unsuccessful because of the varying Sn<sup>2+</sup>/Sn<sup>4+</sup> ratio. We expect higher thermoelectric performance in those quasi-isostructural alloys if their carrier concentration can be fully optimized.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsaem.1c01155?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsaem.1c01155</a>.Temperature-dependent heat capacity (<i>C</i><sub>p</sub>), thermal diffusivities (<i>D</i>) and Lorenz number (<i>L</i>) for Cu<sub>2+<i>x</i></sub>Sn<sub>1–<i>x</i></sub>Sb<sub><i>x</i></sub>Se<sub>3+<i>x</i></sub> (<i>x</i> = 0, 0.2, 0.5, 0.8, and 1.0). The longitudinal (ν<sub>l</sub>) and transverse (ν<sub>t</sub>) acoustic velocities, calculation of average acoustic velocity (<i>v</i><sub>s</sub>) (<a class="ext-link" href="/doi/suppl/10.1021/acsaem.1c01155/suppl_file/ae1c01155_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,chemistry, physical,energy & fuels