Terahertz Nondestructive Characterization of Conformal Coatings for Microelectronics Packaging
H. Shi,S. Calvelli,M. Zhai,M. Ricci,S. Laureti,P. Singh,H. Fu,A. Locquet,D.S. Citrin,Haolian Shi,Serena Calvelli,Min Zhai,Marco Ricci,Stefano Laureti,Alexandre Locquet,D. S. Citrin
DOI: https://doi.org/10.1109/tcpmt.2023.3347298
2024-03-02
IEEE Transactions on Components Packaging and Manufacturing Technology
Abstract:Measuring the thickness of conformal coatings (CCs) and detecting defects in a nondestructive and noncontact fashion are important to ensure the reliability and performance of packaged electronic components and systems. In this study, we explore the application of terahertz (THz) time-of-flight tomography (TOFT), a noncontact and nondestructive method applied to conformal-coating thickness. We measure the time delay of THz pulses reflected (echoes) from fabricated structures covered by a CC to ascertain coating thickness. Orthogonal matching pursuit (OMP) is applied to deconvolve reflected THz signals from various interfaces, viz., air/CC and CC/substrate. By these means, we map the conformal-coating thickness distribution over significant areas. The CC thickness found over the metal area is , while it is over the metal-free area. Moreover, the Gaussian mixture model (GMM), a machine-learning algorithm, is used to detect a possible defect-rich region within the CC itself.
engineering, manufacturing, electrical & electronic,materials science, multidisciplinary