Guest Editorial - Selected Papers From the 2017 IEEE International Solid-State Circuits Conference

A. Burdett,P. Mohseni,R. Genov,Maysam Ghovanloo

DOI: https://doi.org/10.1109/TBCAS.2017.2779253

Abstract:

What problem does this paper attempt to address?

Guest Editorial 2019 Custom Integrated Circuits Conference

Nan Sun,Jane Gu

DOI: https://doi.org/10.1109/jssc.2019.2961757

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of the IEEE Journal of Solid-State Circuits features expanded versions of key articles presented at the 2019 Custom Integrated Circuits Conference (CICC) held at Hilton, Austin, TX, USA, from April 14 to April 17.
Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Vadim Gutnik,Nikolaus Klemmer,Zhihua Wang,Michael Green,Roland Thewes

DOI: https://doi.org/10.1109/jssc.2009.2032593

IF: 5.4

2009-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 37 papers in this special issue were originally presented at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco, CA, in February 2009. They were take from the best of the Analog, Data Converters, RF, Wireless Communications, Wireline Communications, and MEMS, Imagers, and Display sessions.
Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Jung-Hwan Choi,Po-Chiun Huang,Woogeun Rhee,Shouyi Yin

DOI: https://doi.org/10.1109/jssc.2022.3196310

IF: 5.4

2022-01-01

IEEE Journal of Solid-State Circuits

Abstract:The Special Issue of the IEEE Journal of Solid- State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2021 Asian Solid-State Circuits Conference (A-SSCC). This year, the A-SSCC 2021 is held as a hybrid conference on November 7-10, 2021 with attendees having the option to join the in-person meeting in Busan, Korea, or participate virtually through on-line platform. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 17th appearance in 2021 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2021, only two-page format articles are allowed for submission and publication.
Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Hussam Amrouch,Di Gao,Xiaobo Sharon Hu,Arman Kazemi,Ann Franchesca Laguna,Kai Ni,Michael T. Niemier,Mohammad Mehdi Sharifi,Simon Thomann,Xunzhao Yin,Cheng Zhuo

DOI: https://doi.org/10.1109/ICCAD51958.2021.9643578

2021-01-01

Abstract:The rapidly increasing volume and complexity of data is demanding the relentless scaling of computing power. With transistor feature size approaching physical limits, the benefits that CMOS technology can provide is diminishing. For future energy efficient computing systems, researchers aim to exploit various emerging nanotechnologies to replace conventional CMOS technology. In particular, ferroelectric FETs (FeFETs) appear to be a promising candidate to continue improving energy efficiency for data-intensive applications. Advances in FeFET scalability and FeFET compatibility with CMOS have sparked growing interest in device, circuit, and system communities. While FeFET is still evolving, many researchers and developers are already cautiously optimistic about its future. This paper provides a review on FeFET's recent technology advances, challenges, and opportunities, with a particular emphasis upon device modeling and circuit design of FeFET content addressable memory, as well as their applications in machine learning.
Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Samuel Palermo,Nan Sun

DOI: https://doi.org/10.1109/jssc.2019.2893079

IF: 5.4

2019-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits features expanded versions of key papers presented at the 2018 Custom Integrated Circuits Conference (CICC), held in the DoubleTree Mission Valley in San Diego, CA, USA, April 8–11.
Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2022.3222727

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is Building on 70 Years of Innovation in Solid-State Circuit Design. The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this years ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

English Else
Guest editorial: Selected papers from IEEE ICCC'12

Zhisheng, N.,Molisch, A.F.,Junshan, Z.

DOI: https://doi.org/10.1109/CC.2013.6457525

2013-01-01

Abstract:The papers in this special issue were presetned at the First IEEE International Conference on Communications in China (ICCC'12) that was held in Beijing, China, 15-17 August, 2012.
Topics in integrated circuits for communications [Guest editorial]

Charles Chien,Zhiwei Xu,Stephen Molloy

DOI: https://doi.org/10.1109/mcom.2011.5741154

IF: 9.03

2011-01-01

IEEE Communications Magazine

Abstract:The dream of being able to stay connected anywhere and at any time has finally come true with the advent of smartphones in late 2006. Since then smartphones have proliferated rapidly. In 2010, 300 million smartphones were shipped worldwide, up nearly 75 percent from 2009. Soon more than half of the communication systems on chips (SoCs) in the cellular market will be geared for smartphones. Aside from delivering high throughputs enabled by 3G/4G communication processing, such SoCs offer integrated support for myriad peripheral functions including Wi-Fi, GPS, Bluetooth, and FM radio. Moreover, these highly sophisticated SoCs will have computation power upwards of a few GHz hosting powerful operating systems that enable innovations and customizations essential to create feature rich multimedia services in a portable handheld device.
Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Denis C. Daly,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2019.2952282

2020-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2020 is "Integrated Circuits Powering the Artificial Intelligence (AI) Era." Advances in solid-state circuits and systems have brought ever more powerful communication and computational capabilities into mobile form factors. Such ubiquitous smart devices lie at the heart of a revolution shaping how we connect, collaborate, build relationships, and share information. These social technologies enable people to maintain connections and support networks not otherwise possible; they provide the ability to access information instantaneously and from any location, thereby helping to shape world events and culture, empower citizens of all nations, and create social networks that help worldwide communities develop and form bonds based on common interests.

English Else
Editorial Welcome to the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS)

Firooz Aflatouni,Lucien Breems,Edoardo Charbon,Qinwen Fan,Hossein Hashemi,Antonio Liscidini,Woogeun Rhee,Stefan Rusu,Jae-Sun Seo,Jerald Yoo,Kathy Wilcox,Eugenio Cantatore

DOI: https://doi.org/10.1109/OJSSCS.2021.3108267

2021-01-01

IEEE Open Journal of the Solid-State Circuits Society

Abstract:Dear Readers, The editorial board is pleased to welcome you to the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS). Our first papers will soon be available online via the IEEEXplore <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> platform.
The Impact of Emerging Technologies on Architectures and System-level Management: Invited Paper.

Joerg Henkel,Hussam Amrouch,Martin Rapp,Sami Salamin,Dayane Reis,Di Gao,Xunzhao Yin,Michael Niemier,Cheng Zhuo,X. Sharon Hu,Hsiang-Yun Cheng,Chia-Lin Yang

DOI: https://doi.org/10.1109/iccad45719.2019.8942102

2019-01-01

Abstract:The goal of this work is to introduce and discuss different kinds of emerging technologies for logic circuitry and memory with respect to the key question of how they will impact future system-on-chip architectures and system-level management techniques. It is obvious that emerging technologies should have an impact there in order to fully exploit their technological advantages but also in order to deal with any disadvantages they might come with. In this special session paper, three promising emerging technologies are presented: (i) Negative Capacitance Field-Effect Transistor (NCFET) as a new CMOS technology with advantages primarily for low-power design, (ii) Ferroelectric FET (FeFET) as a non-volatile, area-efficient and low-power combined logic and memory as well as (iii) a Phase-Change Memory (PCM) and Resistive RAM (ReRAM) offering a large potential for tackling the memory wall problem in the von Neumann architecture. Our analysis demonstrates that not only new computing paradigms are promoted by these new technologies, it will also be seen that the trade-offs between the classical design parameters of low power, performance etc. will shift and hence emerging technologies will offer new Pareto points in the design space of future on-chip architectures. In that context, this work is unique as it bridges the gap between the technology side and system/architecture-level side to draw a vision of new technologies and their impact on architectures and system-level management.
Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Chung-Chih Hung,Mohamed Atef,Vanessa Chen

DOI: https://doi.org/10.1109/tbcas.2024.3434009

2024-08-24

IEEE Transactions on Biomedical Circuits and Systems

Abstract:The 12 articles in this special issue were presented at the 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS) in Toronto, Canada, from October 19–21, 2023. BioCAS 2023 was jointly sponsored by the IEEE Circuits and Systems (CAS) Society, IEEE Solid-State Circuits (SSC) Society, and the IEEE Engineering in Medicine and Biology (EMB) Society.

engineering, biomedical, electrical & electronic
Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Kenichi Okada

DOI: https://doi.org/10.1109/jssc.2024.3379608

IF: 5.4

2024-04-27

IEEE Journal of Solid-State Circuits

Abstract:This special section of the IEEE Journal of Solid-State Circuits presents the expanded versions of selected articles presented at the 2023 Radio Frequency Integrated Circuits Symposium (RFIC) held in San Diego, CA, USA, during June 11–13, 2023. The RFIC Symposium is the world's premier conference focused on RF and millimeter-wave (mmWave) integrated circuits and systems technology. In addition to showcasing state-of-the-art high-frequency IC design techniques, the conference has evolved to encompass a wide range of emerging technologies and applications, including wireless/wireline communication, cryogenic technology, and other innovations in RF, millimeter-wave, terahertz-wave, and analog/mixed-signal ICs. The collection of papers in this special Section reflects the diversity and multidisciplinary nature of the RFIC Symposium.

engineering, electrical & electronic
Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Tahir Hussain,Dana C. Wheeler,Hasan Sharifi,Keisuke Shinohara,Zhiwei Xu,James C. Li,Pamela R. Patterson,Kenneth R. Elliott,Wonill Ha,Yakov Royter,Peter D. Brewer

DOI: https://doi.org/10.1109/sirf.2014.6828535

2014-01-01

Abstract:HRL Laboratories is part of an intense research and development effort to leverage the enormously advanced infrastructure of Si CMOS and the high performance of diverse electronic and photonic devices in an integrated technology. While System in a Package (SiP) and System on a Chip (SoC) approaches involve chips produced in their native foundries and subsequent integration using hybridization or multi-chip modules, HRL has pioneered approaches where partially completed wafers of diverse technologies are integrated using highly intimate placement and heterogeneous interconnects to enable transistor-level integration. Novel ICs have been produced in InP BiCMOS and CMOS memristor-integrated technologies. Unprecedented design flexibility is being enabled with intimate integration of GaN HEMTs together with InP and CMOS.
Guest Editorial: Special Issue on Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications

Matteo Meneghini,Geok Ing Ng,Farid Medjdoub,Matteo Buffolo,Shireen Warnock,Digbijoy Nath,Jun Suda,Junxia Shi,Shyh-Chiang Shen

DOI: https://doi.org/10.1109/ted.2024.3359934

IF: 3.1

2024-03-06

IEEE Transactions on Electron Devices

Abstract:On behalf of myself and the other guest editors for the Special Issue on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications" featured in this month's IEEE Transactions on Electron Devices, we are pleased to offer readers a selection of papers that span the contemporary landscape of wide and ultrawide bandgap semiconductor devices.

engineering, electrical & electronic,physics, applied
Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2021.3128243

2022-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is Intelligent Silicon for a Sustainable World. This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability.

English Else
A-SSCC 2021 Forward

Eun-Young Jung,Christopher J. Charles,Youngcheol Chae,Alioto Massimo,Changwoo Yoon,Woogeun Rhee

DOI: https://doi.org/10.1109/a-sscc53895.2021.9634178

2021-01-01

Abstract:Welcome to the IEEE Asian Solid-State Circuits Conference (A-SSCC) 2021.This year, the A-SSCC 2021 is held as a hybrid conference from Nov. 7th to Nov. 10th with attendees having the option to join the in-person meeting in Busan, Korea or participate virtually through on-line platform.Being one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, A-SSCC has grown to be a leading conference in the field of integrated circuits and systems design.The conference theme for this year is "Integrated Circuits and Systems for the Connection of Intelligent Things".The impact of COVID-19 has accelerated the trend of the mobile connectivity.Thereby, the role of integrated circuits has been more critical than ever to build an intelligent connection between human and human with high security and low power.The A-SSCC 2021 presents innovative silicon systems and circuit solutions to enrich our life with the Connection of Intelligent Things.This year, we received 249 submissions from 21 countries and regions around the world.Among all submissions, 94% of papers presented measurement results with silicon chips.After rigorous review process, the Technical Program Committee (TPC) selected 103 high quality papers with the acceptance rate of 41%.In addition, we invited 5 student papers from ESSCIRC 2021, having 108 technical paper presentations.From the A-SSCC 2021, the technical program is extended from a 3-day program to a 4-day program.Four plenary speeches are given by distinguished scholars and industry leaders.In the morning of Nov. 8,
International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Haikun Jia,Baoyong Chi

DOI: https://doi.org/10.1007/s11432-019-9873-x

2019-01-01

Science China Information Sciences

Abstract:>The International Solid-State Circuits Conference(ISSCC) is well known as the best global forum with respect to solid-state circuits and systems-ona-chip. Held in San Francisco in January or February each year, the conference attracts more than
Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Mototsugu Hamada,Ron Kapusta

DOI: https://doi.org/10.1109/jssc.2024.3357259

IF: 5.4

2024-03-29

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. The Symposium was held in person, June 11–16, 2023, in Kyoto, Japan.

engineering, electrical & electronic

Guest Editorial - Selected Papers From the 2017 IEEE International Solid-State Circuits Conference

Guest Editorial 2019 Custom Integrated Circuits Conference

Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Guest editorial: Selected papers from IEEE/CIC ICCC2014

ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Guest editorial: Selected papers from IEEE ICCC'12

Topics in integrated circuits for communications [Guest editorial]

Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Editorial Welcome to the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS)

The Impact of Emerging Technologies on Architectures and System-level Management: Invited Paper.

Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Guest Editorial: Special Issue on Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications

Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

A-SSCC 2021 Forward

International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits