Abstract:Water has been recognized in promoting material removal, traditionally ascribed to friction reduction and thermal dissipation. However, the physicochemical interactions between water and the workpiece have often been overlooked. This work sheds light on how the physicochemical interactions that occur between water (H2O) and copper (Cu) workpiece influence material deformations during the cutting process. ReaxFF molecular dynamics simulations were employed as the primary method to study the atomistic physical and chemical interactions between the applied medium and the workpiece. Upon contact with the Cu surface, H2O dissociated into OH- ions, H+ ions, and traces of O2- ions. The OH- and O2- ions chemically reacted with Cu to form bonds that weakened the Cu-Cu bonds by elongation, while the H+ ions gained electrons and diffused into the Cu lattice as H- ions. The weakening of surface Cu bonds promoted plastic deformation and reduced the difficulty of material removal. Meanwhile, further addition of H2O molecules saw a plateau in hydrolysis and more dominance of H2O physical adsorption on Cu, which weakens the elongation of Cu-Cu bonds. While the ideal case for atomic-scale material removal was found with an optimal number of 240 H2O molecules, the presented Cu material state with more H2O molecules could account for the observations in microcutting. The constricted nature of physical adsorption and hydrogen ion diffusion in the surface layer prevented the propagation of dislocations through the surface, which subsequently caused pinning points to be closer together during chip formation as observed by smaller chip fold widths on the microscale. Theoretical and experimental analysis identified the importance of accounting for physicochemical interactions between surface media and the workpiece when considering material deformations at micronanoscale.

Soft X-ray Induced Radiation Damage in Dip-and-Pull Photon Absorption and Photoelectron Emission Experiments

Soft X-ray induced photoreduction of organic Cu(II) compounds probed by X-ray absorption near-edge (XANES) spectroscopy.

X-ray Effects on the Oxidation of Cu Nanoparticles

X-ray Irradiation Induced Peak Shift of Cu 2p3／2 Photoelectron Emission and Intra-molecule Charge Transfer in Copper Phthalocyanine

Investigation of synchrotron X-ray induced oxidation of Ag–Cu thin-film

Reduction of copper oxides by UV radiation and atomic hydrogen studied by XPS

XAFS and HAXPES analyses of the oxidation state of a copper surface buried under a phenolic resin nanofilm

Orientation-dependent oxidation behavior of Cu under In-situ E-Beam irradiation

Temporal-Spatial Measurement of Surface Morphological Evolution Time in Nanosecond Laser Irradiation on the Copper Film

Effect of UV light irradiation on charge neutralization in XPS measurements

Effect of Impurity and Illumination on Copper Oxidation after Chemical Mechanical Polishing

Mechanical Properties of Self-Irradiated Single-Crystal Copper

Dynamics of femtosecond heated warm dense copper with time-resolved L3-edge XANES

Progress in Photochemistry of Copper in Aquatic Systems

Radiolysis of copper cyanide solution by electron-beam irradiation

Triple Effects of the Physicochemical Interaction between Water and Copper and Their Influence on Microcutting

Softening Effects Due to Reorientations of Cu Precipitates in Α-Iron: Atomistic Simulations of Dislocations-Obstacles Interactions

Impacts of Hot Electron Diffusion, Electron-Phonon Coupling, and Surface Atoms on Metal Surface Dynamics Revealed by Reflection Ultrafast Electron Diffraction

Surface‐enhanced resonance Raman scattering in partially oxidized thin copper film

Reactive oxygen species generation by copper(II) oxide nanoparticles determined by DNA damage assays and EPR spectroscopy

3D real-space calculations of continuum response