Abstract:Catalysts are critical components for chemical reactions in industrial applications. They are able to optimize selectivity, efficiency, and reaction rates, thus enabling more environmentally friendly processes. This work presents a novel approach to catalyst functionalization for the CO2 reduction reaction by combining the reactive species of an atmospheric pressure plasma jet with the electric fields and energy input of a laser. This leads to both a nanoscale structuring as well as a controllable chemical composition of the surface, which are important parameters for optimizing catalyst performance. The treatment is conducted on thin copper layers deposited by high power pulsed magnetron sputtering on silicon wafers. Because atomic oxygen plays a key role in oxidizing copper, two photon absorption fluorescence is used to investigate the atomic oxygen density in the interaction zone of the COST plasma jet and a copper surface. The used atmospheric pressure plasma jet provides an atomic oxygen density at the surface in a distance of 8 mm to the jet nozzle of approximately or a flux of . Pulsed laser-induced dewetting is used to form nanoparticles from the deposited copper layer to enhance catalytic performance. Varying the layer thickness allows control of the size of the particles. A gas flow directed on the sample during the combined treatment disturbs the particle formation. This can be prevented by increasing the laser energy to compensate for the cooling effect of the gas flow. Investigating the surface using X-ray photoemission spectroscopy reveals that the untreated copper layer surface consists mostly of metallic copper and Cu(I) oxide. Irradiating the sample only with the laser did not change the composition. The combination of plasma and laser treatment is able to produce Cu(II) species such as CuO, whose concentration increases with treatment time. The presented process allows the tuning of the ratio of C2O/CuO, which is an interesting parameter for further studies on copper catalyst performance.

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