The benefit of heparin-bound circuits.

A. Moulijn,B. Amsel

DOI: https://doi.org/10.1016/S0022-5223(96)70294-5

IF: 6.439

1996-08-01

Journal of Thoracic and Cardiovascular Surgery

Abstract:

What problem does this paper attempt to address?

Effects of the Ultrasonic Flexural Vibration on the Interaction Between the Abrasive Particles; Pad and Sapphire Substrate During Chemical Mechanical Polishing (CMP)

Wenhu Xu,Xinchun Lu,Guoshun Pan,Yuanzhong Lei,Jianbin Luo

DOI: https://doi.org/10.1016/j.apsusc.2010.10.088

IF: 6.7

2010-01-01

Applied Surface Science

Abstract:In this paper, the technique of ultrasonic flexural vibration assisted chemical mechanical polishing (UFV-CMP) was used for sapphire substrate CMP. The functions of the polishing pad, the silica abrasive particles, and the chemical additives of the slurry such as pH value regulator and dispersant during the sapphire's UFV-CMP were investigated. The results showed that the actions of the ultrasonic and silica abrasive particles were the main factors in the sapphire material removal rate (MMR) and the chemical additives were helpful to decrease the roughness of sapphire. Then the effects of the flexural vibration on the interaction between the silica abrasive particles, pad and sapphire substrate from the kinematics and dynamics were investigated to explain why the MRR of UFV-CMP was bigger than that of the traditional CMP. It indicated that such functions improved the sapphire's MRR: the increasing of the contact silica particles’ motion path lengths on the sapphire's surface, the enhancement of the contact force between the contact silica particles and the sapphire's surface, and the impaction of the suspending silica particles to the sapphire's surface.
Experimental Study of Ultrasonic Vibration Assisted Chemical Mechanical Polishing for Sapphire Substrate

Wenhu Xu,Xinchun Lu,Guoshun Pan,Jianbin Luo,Chenhui Zhang

DOI: https://doi.org/10.1007/978-3-642-03653-8_144

2009-01-01

Abstract:Sapphire is an important substrate material widely used in a range of applications such as optics, electrics, and IC industry. In many of those applications, critical surface quality demands of sapphire are required. Chemical mechanical polishing (CMP) has been proved to be a available method to produce high quality surface for sapphire substrate. But there are still some disadvantages in traditional CMP system, for example, the material removal rate (MRR) is very low. In order to improve the MRR, an ultrasonic vibration assisted CMP system is developed. The polishing tool is vibrated along horizontal direction at an ultrasonic frequency with piezo-electric actuators. In our study, the MRR of sapphire is about twice as much as the traditional method with the help of ultrasonic energy. And the reasons of improving the MRR by the ultrasonic vibration assisted CMP are also discussed.
Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire

Mufang Zhou,Min Zhong,Wenhu Xu

DOI: https://doi.org/10.1007/s40544-022-0713-7

IF: 4.924

2023-02-23

Friction

Abstract:Abstract Ultrasonic-assisted chemical mechanical polishing (UA-CMP) can greatly improve the sapphire material removal and surface quality, but its polishing mechanism is still unclear. This paper proposed a novel model of material removal rate (MRR) to explore the mechanism of sapphire UA-CMP. It contains two modes, namely two-body wear and abrasive-impact. Furthermore, the atomic force microscopy (AFM) in-situ study, computational fluid dynamics (CFD) simulation, and polishing experiments were conducted to verify the model and reveal the polishing mechanism. In the AFM in-situ studies, the tip scratched the reaction layer on the sapphire surface. The pit with a 0.22 nm depth is the evidence of two-body wear. The CFD simulation showed that abrasives could be driven by the ultrasonic vibration to impact the sapphire surface at high frequencies. The maximum total velocity and the air volume fraction (AVF) in the central area increased from 0.26 to 0.55 m/s and 20% to 49%, respectively, with the rising amplitudes of 1–3 μm. However, the maximum total velocity rose slightly from 0.33 to 0.42 m/s, and the AVF was nearly unchanged under 40–80 r/min. It indicated that the ultrasonic energy has great effects on the abrasive-impact mode. The UA-CMP experimental results exhibited that there was 63.7% improvement in MRR when the polishing velocities rose from 40 to 80 r/min. The roughness of the polished sapphire surface was R a = 0.07 nm. It identified that the higher speed achieved greater MRR mainly through the two-body wear mode. This study is beneficial to further understanding the UA-CMP mechanism and promoting the development of UA-CMP technology.

engineering, mechanical
Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

Zhang Chenglong,Feng Pingfa,Zhang Jianfu

DOI: https://doi.org/10.1016/j.ijmachtools.2012.07.009

IF: 10.331

2013-01-01

International Journal of Machine Tools and Manufacture

Abstract:Sapphire, widely used in high-speed integrated-circuit chips, thin-film substrates, and various electronic components, is regarded as one of the most difficult to cut materials owing to its great hardness and low fracture toughness. Ultrasonic vibration-assisted machining (UVAM) is an effective processing method for hard and brittle materials that has been explored in many experimental and theoretical investigations. To expose the material removal mechanism in the UVAM of sapphire, the deformation features of (0001) C-plane sapphire in ultrasonic vibration-assisted scratch (UVAS) tests were compared with those in traditional scratch tests. A self-designed and manufactured spherical diamond indenter was employed. The scratch loads (i.e., the normal forces and tangential forces) were measured with a Kistler dynamometer. The plastic and brittle deformation characteristics were observed by scanning electron microscopy. Raman spectroscopy was employed to reveal the residual stress features of deformation zones in the scratch grooves. The experimental results revealed that the UVAS process can reduce scratch loads, effectively inhibit microcrack propagation, and improve the plastic removal proportion, which was rationalized with elastic and residual stress field calculations. With increasing scratch depth, the distribution of residual stress changes from tensile stress to compressive stress as indicated by the Raman-peak shift.
Machining behavior and experimental investigation of ultrasonic vibration assisted belt flapwheel flexible polishing

Danni Lu,Kaining Shi,Yaoyao Shi,Zhaoqing Zhang,Yihui Song,Zhe He,Yuchang Fan,Zhen Chen

DOI: https://doi.org/10.1007/s00170-024-13380-7

IF: 3.563

2024-03-21

The International Journal of Advanced Manufacturing Technology

Abstract:The integral blisk has been widely used in aerospace, and its structural performance is inextricably linked to the blade surface quality. To improve the surface integrity of polished surface, ultrasonic vibration assisted belt flapwheel flexible polishing (UBFP) is proposed. In this study, the polishing principle of UBFP and the effects of vibration on surface generation are investigated, and kinematic analyses and trajectory simulations are performed. Furthermore, the influences of the main processing parameters on the polishing force and surface roughness in UBFP are explored experimentally, and the sensitivity of the main parameters is distinguished by multi-parameter relative sensitivity analysis based on Monte Carlo simulation. The results show that the ultrasonic vibration contributes to the polishing process primarily through kinematic state changing and trajectories interlacing of abrasives. Compared with conventional belt flapwheel flexible polishing, the polishing force decreases by 15.72% and the surface roughness decreases by 17.39%. The compression depth is the most sensitive parameter in the process of UBFP. This study demonstrates the feasibility of UBFP and provides a theoretical and experimental reference for improving the polishing surface quality of the blisk blade.

engineering, manufacturing,automation & control systems
A New Method for Key Frame Based Video Content Representation

A. Hanjalic,R. Lagendijk,J. Biemond

DOI: https://doi.org/10.1142/9789812797988_0009

Abstract:
An in Situ Study of Chemical-Mechanical Polishing Behaviours on Sapphire (0001) Via Simulating the Chemical Product-Removal Process by AFM-tapping Mode in Both Liquid and Air Environments

Xiaolei Shi,Li Xu,Yan Zhou,Chunli Zou,Rongrong Wang,Guoshun Pan

DOI: https://doi.org/10.1039/c8nr04645j

IF: 6.7

2018-01-01

Nanoscale

Abstract:Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most advanced techniques for achieving an atomic-level smooth surface. However, the mechanism of CMP is still unclear, and the in situ characterization of CMP behaviors at the nanoscale has been a challenge for decades. In this study, we, for the first time, report an in situ study of CMP behaviors on sapphire (0001) via simulating the chemical product-removal process by using atomic force microscopy (AFM) in tapping mode. Through a combination of intensive experimental measurements and detailed structural characterizations, it is shown that the AFM probe in tapping mode can act as a polishing abrasive to realize simultaneous imaging and chemical product removal on sapphire (0001), thus achieving successful in situ characterizations in both liquid and air environments. This work fills in gaps relating to fundamental CMP mechanisms, and provides a new perspective for the study of CMP behaviors on different materials.
Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Hailong Xu,Zhen Yin,Qing Miao,Chenwei Dai,Jingcai Cheng,Hua Li,Zhiqiang Liang,Zhanjie Li

DOI: https://doi.org/10.1016/j.mssp.2023.107990

IF: 4.1

2023-11-30

Materials Science in Semiconductor Processing

Abstract:Owing to excellent physical and optical characteristics, Sapphire has wide applications in detection, military, photoelectric and other industries. Nevertheless, it's difficult to use the conventional processing methods to process sapphire with high precision and efficiency due to its hardness and brittleness . This study adopted longitudinal-torsional compound ultrasonic vibration end grinding (LTUEG) method to grind sapphire. Firstly, the grinding trajectory equation of single grain under LTUEG was established. Then, combining with the motion state of single grain, the removal mechanism of sapphire under LTUEG was clarified. Finally, a comparative experiment between LTUEG and conventional end grinding (CEG) of sapphire was conducted, and the effects of processing parameters on surface topography and surface roughness were investigated. Results showed that surface roughness declined with grinding speed, enhanced with feed rate and grinding depth, declined first and then went up with amplitude, and the minimum value was 0.522 μm. Compared with CEG, LTUEG could significantly reduce the surface roughness, with a maximum reduction of 20.98 %. LTUEG could reduce the pits size. Meanwhile, when the longitudinal amplitude A L was 0.8 μm, the average pits length and pits depth reached the minimum, which were 33.13 μm and 5.296 μm, respectively. The research found that LTUEG could reduce block spalling, increase the ratio of plastic domain removal as well as improve the surface flatness of workpiece.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Material removal profile prediction and experimental validation for obliquely axial ultrasonic vibration-assisted polishing of K9 optical glass

Sheng Qu,Zixuan Wang,Chao Zhang,Zhelun Ma,Tianqi Zhang,Hao Chen,Zhao Wang,Tianbiao Yu,Ji Zhao

DOI: https://doi.org/10.1016/j.ceramint.2021.08.212

IF: 5.532

2021-12-01

Ceramics International

Abstract:K9 optical glass is one of the typical components in optical systems. However, because of its poor fracture resistance, it is difficult to polish it with ultra-precision and high-efficiency and without any surface damage simultaneously. The emergence of the obliquely axial ultrasonic vibration-assisted polishing (UVAP) method can solve this problem which encounters in polishing efficiency and shape accuracy. However, due to the unclear material removal profile (MRP) mechanism, obliquely axial UVAP is not widely used in the processing field. This paper introduces the obliquely axial UVAP method in research processes, mainly focusing on the fixed point MRP analysis of the obliquely axial UVAP. Based on Hertz's contact theory, polishing pressure, the length of the semi-long axis (LLA) and the length of the semi-short axis (LSA) of the contact area are calculated under ultrasonic vibration conditions. Meanwhile, the relative linear velocity distribution of the oblique polishing tool in the instantaneous contact area is modeled by mathematical geometry method. A novel model of the MRP distribution for obliquely axial UVAP is proposed following the Preston equation. Subsequently, a series of polishing experiments were carried out to verify this model. The results show that the numerical model has good agreement with the experimental results on MRP, LLA, LSA, material removal depth and material removal rate (MRR). In addition, the material removal capability can be significantly improved by larger ultrasonic amplitude and larger oblique angle. This model not only more clearly elucidates the processing mechanism of obliquely axial UVAP, but also provides theoretical support for the polishing of free-form optical lenses.

materials science, ceramics
A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

Yanming Xia,Tao Wang,Lu Song,Xuanyang Li,Shenglin Ma,Rongfeng Luo,Jing Chen,Wei Wang,Yufeng Jin

DOI: https://doi.org/10.1109/nems.2018.8557003

2018-01-01

Abstract:Sapphire has widely used for application to MEMS due to its excellent optical property, mechanical property, chemical stability, high melting point and electrical insulation property, such as X-ray resonator cavities, optical wall shear stress sensor for high temperature applications, lateral overtone bulk acoustic resonator with high f-Q and increasing the output power of LED. This paper presented a high resolution batch-mode micro-utralsonic-machining (μUSM) with constant feed force of sapphire for MEMS application, and it has advantages of high machining efficiency, resolution and surface quality compared to other machining method. High aspect ratio (>4) structure with the feature resolution below 1μm of sapphire has been machined by batch-mode μUSM. A machining depth of 40μm has been achieved at a removal rate up-to 4μm/min, and its bottom surface roughness is below Ra 80nm.
AFM and XPS Studies on Material Removal Mechanism of Sapphire Wafer During Chemical Mechanical Polishing (CMP)

Yan Zhou,Guoshun Pan,Xiaolei Shi,Hua Gong,Li Xu,Chunli Zou

DOI: https://doi.org/10.1007/s10854-015-3668-x

2015-01-01

Journal of Materials Science Materials in Electronics

Abstract:The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studied through X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. XPS results indicate that alumina silicate (Al2Si2O7·2H2O) is generated on the polished sapphire surface by SiO2 slurry, otherwise alumina hydrate (AlO(OH)) on the polished surface by H2O solution. Meanwhile, ultra-smooth polished surface with extremely low Ra of below 0.1 nm and atomic step structure morphology via AFM is realized using SiO2 slurry. Through investigating the variations of the surface characteristics polished by different ingredients via the morphology and force curve measurements, it’s reveals that the product-aluminum silicate with stronger adhesion and lower hardness is more readily to generate and be removed than the product-alumina hydrate induced by H2O. Thus, except for atomic scale mechanical abrading, the abrasive SiO2 nanoparticle is used for anticipating in the chemical reaction, resulting in superior surface finish of sapphire wafer with high efficiency.
Parameter optimization of ultrasonic vibration polishing K9 optical glass based on ultrasonic atomization

Sheng Qu,Fanwei Meng,Liaoyuan Chen,Zhelun Ma,Zixuan Wang,Ming Li,Tianbiao Yu,Ji Zhao

DOI: https://doi.org/10.1016/j.ceramint.2022.03.269

IF: 5.532

2022-04-01

Ceramics International

Abstract:To further improve the surface finish and processing efficiency of optical components, ultrasonic vibration technology is frequently combined with conventional processing and the process parameters that play a critical role in this composite processing are identified. This research proposes an ultrasonic vibration polishing method based on ultrasonic atomization (UA-UVP). The polishing performance of K9 optical glass is increased by ultrasonic atomization (UA) assisted by polishing solvent for ultrasonic vibration polishing (UVP). Orthogonal experiments are used to study the effects and variation laws of the flow rate of ultrasonic atomization (Q), the gap distance between the polishing tool and workpiece (G), ultrasonic electro spindle speed (W), abrasive particle size (D) and ultrasonic amplitude (A) on surface roughness (SR) and material removal rate (MRR), respectively. When these two polishing characteristics are considered together, the optimization of polishing parameters becomes complicated. Therefore, the principal component analysis (PCA) and grey relational analysis (GRA) methods were employed to the optimal experimental combination as Q:18 ml/min, G: 5 μm, W: 4000 r/min, D: 0.5 μm, A: 8 μm. The experimental results showed that Ra and MRR were measured as 10.466 nm and 0.473*10^8 μm3/min, respectively. Compared with the best experimental combination of orthogonal experiments, the improvement rates of SR and MRR were 26.65% and 25.80%, respectively. Overall, the application of ultrasonic vibration technology contributes to enhancing the uniform distribution of polished abrasive particles and improving the polishing characteristics.

materials science, ceramics
Predictive modeling and experimental study of polishing force for ultrasonic vibration-assisted polishing of K9 optical glass

Chao Zhang,Sheng Qu,Yingdong Liang,Xin Chen,Ji Zhao,Tianbiao Yu

DOI: https://doi.org/10.1007/s00170-021-08624-9

IF: 3.563

2022-01-05

The International Journal of Advanced Manufacturing Technology

Abstract:With the development of science and technology, many precision fields have higher requirements for the machining quality and precision of hard and brittle materials. Brittle materials such as glass and ceramics have fragile physical properties, resulting in poor stability during machining. Ultrasonic vibration-assisted polishing (UVAP) is suitable for machining various brittle materials and can well solve the machining problems caused by the characteristics of brittle materials. In order to ensure the machining quality, a polishing force model of K9 optical glass for different processing parameters is established in this paper. The new model mainly considers the following aspects: (1) Considering the randomness of shape, the truncated polyhedral model is used to model the abrasive particles. (2) Based on the fractal theory and mathematical statistics, a microscopic morphology model of the polishing tool is established. (3) Based on the N–S equation, a polishing force model considering the micro-contact states of the polishing tool, abrasive particles, and workpiece is established. By comparing with the experimental results, the new model has high accuracy in predicting the polishing force. The new model and results lay the foundation for the subsequent research of brittle materials.
Modeling and prediction of generated local surface profile for ultrasonic vibration-assisted polishing of optical glass BK7

Tianqi Zhang,Zixuan Wang,Tianbiao Yu,Hao Chen,Jinlong Dong,Ji Zhao,Wanshan Wang

DOI: https://doi.org/10.1016/j.jmatprotec.2020.116933

IF: 6.3

2021-03-01

Journal of Materials Processing Technology

Abstract:With the rapid progress of science and technology, many applications of hard and brittle materials require advanced and suitable machining-techniques. One technique in particular, ultrasonic vibration-assisted polishing (UVAP), has been studied intensively by researchers worldwide. These studies indicate that UVAP has the capability to improve the surface quality as well as the machining efficiency. However, few studies focus on the deterministic material-removal of UVAP. The difference between generated and theoretical surface profiles determines the surface accuracy. Therefore, this paper focuses on predicting the generated local surface profile and providing a theoretical basis to reduce this error by controlling the polishing parameters. In addition to the axial ultrasonic vibration of polishing tool, ultrasonic atomization was adopted to provide uniformly distributed polishing slurry. To ensure sufficient surface-accuracy, it is necessary to predict the generated surface profile for a fixed spot as a basis research. This means, to enable accurate predictions the following improvements are realized: (i) A novel model for the elastic spherical contact-deformation of the polishing tool is used to calculate both the polishing force and contact radius. It takes into account the nonlinear elasticity of the polishing tool and the lateral extension of the contact area, which makes it more consistent with the actual deformation. (ii) A novel model for the material-removal distribution function for UVAP is proposed, based on the Preston equation. It considers the periodic changes of polishing force and contact radius caused by ultrasonic vibration. (iii) A series of fixed-spot polishing experiments on BK7 glass are carried out to verify the proposed models. The results show that the Preston coefficient is affected by axial ultrasonic amplitude, and large ultrasonic amplitude improves the polishing ability. In addition, the generated local surface profile, the maximum contact radius, as well as the material-removal depth and material-removal rate (MRR) can be predicted well. The new models not only provide a possibility to realize deterministic material removal but also enables in-depth-understanding of UVAP. It also represents a basic theoretical foundation for future, flat or free-form surface-polishing.

materials science, multidisciplinary,engineering, manufacturing, industrial
Abrasive Jet Polishing Utilizing the Synergistic Effect of Ultrasonic Pulse-Cavitation and Process Optimization Research

Yile Ren,Jiangqin Ge,Bilu Shao,Kengqing Xu

DOI: https://doi.org/10.1007/s13369-024-09242-9

IF: 2.807

2024-06-05

Arabian Journal for Science and Engineering

Abstract:Compared to the traditional abrasive jet polishing method, the ultrasonic coupled abrasive jet polishing (UC-AJP) method that utilizes the synergistic effects of pulse and cavitation can achieve a higher polishing efficiency. To further improve the polishing quality of the UC-AJP method, process optimization research was conducted on the quartz glass as the polishing object. The research was divided into two stages. In the first stage: the orthogonal array of the Taguchi method (TM) was used to design the experiments; the process parameters were optimized and the significant control factors were obtained through the signal-to-noise (S/N) ratio and analysis of variance (ANOVA). In the second stage: the response surface methodology (RSM) was used to establish the linear roughness prediction model and the interaction law of process parameters in the UC-AJP process was revealed, then the significant control factors were further optimized. On the basis of the above work, application research was conducted on the glass-based micro-channels with different cross-sectional structures, which verified the performance of the UC-AJP method for conformal polishing. After polishing with the optimized UC-AJP process parameters, the surface roughness of the workpiece decreases from 0.2640 to 0.0460 μm, and the surface roughness improvement rate is 82.6%.

multidisciplinary sciences
Study of the inhibition mechanism of sapphire subsurface damage by tangential ultrasonic vibration

Fei ZhouJinkai XuWentong ZhangHuadong Yua School of Mechanical and Electrical Engineering,Changchun University of Science and Technology,Changchun,Chinab Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing,Changchun University of Science and Technology,Changchun,Chinac School of Mechanical and Aerospace Engineering,Jilin University,Changchun,China

DOI: https://doi.org/10.1080/15376494.2024.2328760

2024-03-23

Mechanics of Advanced Materials and Structures

Abstract:Ultrasonic vibration has a certain effect on the crack propagation tendency during sapphire grinding, but the mechanism of the effect on the crack propagation tendency has not yet been elucidated. In this study, tangential ultrasonic vibratory scratching and normal scratching sapphire processes were simulated using the discrete element method, and the expansion tendency of sub-surface cracks in the scratching sapphire process was analyzed in terms of cutting forces and stresses. The results of the study show that the crack depth decreases with increasing scratch speed and increases with increasing scratch depth; The greater the variation in cutting force, the greater the number of cracks formed and the crack propagation is mainly distributed near the maximum residual tensile stress; The introduction of tangential ultrasonic vibration induces a decrease in residual tensile stresses and an increase in residual compressive stresses, thus inhibiting subsurface crack propagation; The suppression of subsurface cracks becomes more pronounced as the amplitude increases. Finally, tangential ultrasonic vibratory scratching and normal scratching sapphire experiments were comparatively studied and the experimental results were in agreement with the simulation results. This study provides some theoretical guidance for the suppression of subsurface cracks in sapphire materials during the grinding process.

materials science, multidisciplinary,mechanics, composites, characterization & testing
Effect of different grinding strategies on subsequent polishing processes of sapphire

Sheng Wang,Sheng Wang,Guipeng Tie,Feng Shi,Ye Tian,Xiaodong Yang

DOI: https://doi.org/10.1016/j.jmapro.2024.01.026

IF: 5.684

2024-01-28

Journal of Manufacturing Processes

Abstract:The hard-to-process properties associated with high hardness and high brittleness of sapphire drastically limit the services of optics, low-damage or damage-free properties are essential to the performance of sapphire optics. To achieve efficient and damage-free sapphire optics, a series of experiments involving ultra-precision grinding, polishing, and ion beam polishing were conducted. Initially, the surface and subsurface characteristics of sapphire ultra-precision grinding were examined, and the evolution of damage during polishing was discussed. Chemical etching was performed to evaluate the subsurface damage caused by polishing, ion beam polishing was used to eliminate subsurface damage. Finally, focused ion beam (FIB) and transmission electron microscopy (TEM) were employed to analyze the atomic structure of the subsurface. The results demonstrated that ultra-precision grinding can produce a ductile grinding surface and minimize subsurface damage, the difference in grinding damage on the outside and center of the workpiece was suppressed. The evolution of the surface roughness and damage behavior during polishing varied depending on the specific grinding strategy, ultra-precision grinding decreased damage removal time by 1/4. Photothermal absorption was utilized to monitor the damage progression during the polishing process and detect the presence of subsurface damage beneath the Beilby layer. Etching revealed that the subsurface damage was primarily caused by scratches, which was effectively eliminated after ion beam polishing. High-magnification TEM images provided compelling evidence of damage at the close-to-atomic scale for sapphire optics. Only amorphous structures smaller than 2 nm were observed on the subsurface, most of the atomic structure remained intact, albeit with irregular arrangement. Additionally, the grinding marks were mitigated after polishing.

engineering, manufacturing
Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard–Brittle Materials

Dawei An,Jianghui Xian,Yi Zhang,Guoqiang Cheng,Yankai Huang,Zhongwei Liang,Weiqing Huang

DOI: https://doi.org/10.3390/mi15101216

IF: 3.4

2024-09-30

Micromachines

Abstract:Hard–brittle materials are widely used in the optics, electronics, and aviation industries, but their high hardness and brittleness make it challenging for traditional processing methods to achieve high efficiency and superior surface quality. This study aims to investigate the application of ultrasonic local resonant grinding to sapphire to improve the efficiency and meet the requirements for the optical window in the surface roughness of the material. The resonant frequency of a piezoelectric ultrasonic vibration system and the vibration amplitude of a grinding head's working face were simulated and tested, respectively. The results of ultrasonic grinding experiments showed that the local resonant system reduced the surface roughness parameter (Ra) of sapphire to 14 nm and improved its surface flatness to 44.2 nm, thus meeting the requirements for the ultra-precision grinding of sapphire. Compared with a conventional resonant system, the surface roughness of the sapphire ground with the local resonant system was reduced by 90.79%, its surface flatness was improved by 81.58%, and the material removal rate was increased by 31.35%. These experimental results showed that ultrasonic local resonant grinding has better effects than those of conventional ultrasonic grinding in improving surface quality and increasing the material removal rate.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Rotary Ultrasonic Machining of Sapphire: Feasibility Study and Designed Experiments

Chenglong Zhang,Pingfa Feng,Zhijian Pei,Weilong Cong

DOI: https://doi.org/10.4028/www.scientific.net/kem.589-590.523

2013-01-01

Key Engineering Materials

Abstract:Sapphire, widely used in high-speed integrated-circuit chips, thin-film substrates, and various electronic components, is regarded as one of the most difficult to cut materials owing to its great hardness and low fracture toughness. Rotary ultrasonic machining (RUM) has been regarded as an effective processing method for hard and brittle materials. In this paper, RUM process is introduced into the drilling of sapphire for the first time. The feasibility to machine sapphire using RUM is studied. Moreover, results of a designed experimental study into RUM of sapphire are presented to discuss the main effects as well as interaction effects of process parameters (ultrasonic power, spindle speed, and feedrate) on outputs. The process outputs investigated include cutting force and edge chipping size.
A study on mechanism of sapphire polishing using the diamond abrasive by molecular dynamics

Chong Sheng,Min Zhong,Wenhu Xu

DOI: https://doi.org/10.1080/15376494.2021.2012856

2021-12-10

Mechanics of Advanced Materials and Structures

Abstract:Polished sapphire has been widely used because of its superior mechanical and physical characteristics. However, the polishing process of sapphire is still unclear and the processing effects need to be improved. Therefore, the polishing process of sapphire with diamond abrasive particles was studied by molecular dynamics method. The behavior of diamond removing sapphire material in polishing process was researched. The effects of the polishing speed, depth, and the abrasive size were investigated in the aspects of polishing force, surface topography, subsurface damage, removed atoms, temperature distribution and average friction coefficient. The outcomes indicated that the surface temperature of sapphire was higher with the rising polishing velocity, but the subsurface defect of sapphire was deeper. Larger indentation depths resulted in higher forces and temperatures, deeper grooves, more removed atoms and bigger average friction coefficients, but poor polished subsurface. Bigger abrasives gained lower friction coefficients and higher numbers of removed atoms. It was found that both good polishing efficiency and quality are obtained under the speed 150 m/s, the polishing depth 15 Å and the abrasive particle radius 20 Å. This study is helpful to improving the sapphire polishing effects and understanding its polishing process.

materials science, multidisciplinary,mechanics, composites, characterization & testing

The benefit of heparin-bound circuits.

Effects of the Ultrasonic Flexural Vibration on the Interaction Between the Abrasive Particles; Pad and Sapphire Substrate During Chemical Mechanical Polishing (CMP)

Experimental Study of Ultrasonic Vibration Assisted Chemical Mechanical Polishing for Sapphire Substrate

Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire

Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

Machining behavior and experimental investigation of ultrasonic vibration assisted belt flapwheel flexible polishing

A New Method for Key Frame Based Video Content Representation

An in Situ Study of Chemical-Mechanical Polishing Behaviours on Sapphire (0001) Via Simulating the Chemical Product-Removal Process by AFM-tapping Mode in Both Liquid and Air Environments

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Material removal profile prediction and experimental validation for obliquely axial ultrasonic vibration-assisted polishing of K9 optical glass

A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

AFM and XPS Studies on Material Removal Mechanism of Sapphire Wafer During Chemical Mechanical Polishing (CMP)

Parameter optimization of ultrasonic vibration polishing K9 optical glass based on ultrasonic atomization

Predictive modeling and experimental study of polishing force for ultrasonic vibration-assisted polishing of K9 optical glass

Modeling and prediction of generated local surface profile for ultrasonic vibration-assisted polishing of optical glass BK7

Abrasive Jet Polishing Utilizing the Synergistic Effect of Ultrasonic Pulse-Cavitation and Process Optimization Research

Study of the inhibition mechanism of sapphire subsurface damage by tangential ultrasonic vibration

Effect of different grinding strategies on subsequent polishing processes of sapphire

Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard–Brittle Materials

Rotary Ultrasonic Machining of Sapphire: Feasibility Study and Designed Experiments

A study on mechanism of sapphire polishing using the diamond abrasive by molecular dynamics