[Immediate results in a case of liver cirrhosis treated with neurectomy of hepatic artery].

L. Vallega,M. De Gregori,E. Nicora

Pathologica

Abstract:

What problem does this paper attempt to address?

Analysis of temperature distributions in diode-pumped alkali vapor lasers

Qi Zhu,Bailiang Pan,Li Chen,Yajuan Wang,Xunyi Zhang

DOI: https://doi.org/10.1016/j.optcom.2010.02.014

IF: 2.4

2010-01-01

Optics Communications

Abstract:Assuming the pump light to be a Gaussian beam and considering the medium absorption, we establish the heat conduction model to describe the temperature distribution in diode-pumped alkali vapor lasers (DPALs) with two different pumping ways. Combining with the experimental parameters in cesium laser, the spatial temperature distribution picture, the longitudinal and the radial temperature distributions of two cesium lasers are obtained by numerical solving the model. Influences of the pump power, the beam waist and the absorption coefficient on the axial and the radial temperature distribution are calculated and compared for the two Cs lasers. The result suggests that Cs laser pumped by two laser diode arrays can improve the spatial temperature distribution condition and reduce the longitudinal temperature gradient, which is good for reducing the thermal effects and improving the output characteristics of DPALs.
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays

Yao Lu,Zhiqiang Nie,Pu Zhang,Zhenfu Wang,Lingling Xiong,Shuna Wang,Dihai Wu,Xingsheng Liu

DOI: https://doi.org/10.1109/ICEPT.2016.7583094

2016-01-01

Abstract:Thermal stress is an influential factor for the reliability of HPDL and their optical properties. Two packages of conduction-cooled-packaged 60W HPDL were selected as the study samples. In order to investigate what reflow factors influence thermo-mechanical of HPLD, a COS model is established. In reflow process and working process, hard solder package suffers higher thermal stress. Thermal stress mainly comes from reflow process. In reflow process, copper mount will deteriorate thermo-mechanical of hard solder package. There exists shear stress in HPLD and it will convert TE-polarized power to TM-polarized power. In working process, uniaxial normal stress along the width direction of QW is mainly influenced by coefficient expansion thermal. The displacement of HCS along growth direction is larger than that of CS, whereas the “smile” value is smaller. “Smile” is mainly impacted by CTE of solder and submount.
Vascularized Liquid Metal Cooling for Thermal Management of Kw High Power Laser Diode Array

Xu-Dong Zhang,Xue-Peng Li,Yi-Xin Zhou,Jing Yang,Jing Liu

DOI: https://doi.org/10.1016/j.applthermaleng.2019.114212

IF: 6.4

2019-01-01

Applied Thermal Engineering

Abstract:In this paper, the vascularized liquid metal cooling was introduced into the thermal management of high power laser diode array (HPLDA) to realize an excellent heat removal performance. A vascularized liquid metal heat sink, with channel number of 70 and characteristic dimension of 1.8 mm, was firstly designed. And experimental tests and numerical analysis were then conducted. The experimental results indicated that liquid metal cooling can achieve 2000 W heat dissipation of HPLDA, with maximum temperature of heat sink top surface lower than 54 degrees C. The numerical results showed that vascularized liquid metal cooling offers better cooling performance compared to vascularized water cooling when flow rate was bigger than 2.4 l/min. It was also found that the heat capacity resistance was a significant thermal resistance for vascularized liquid metal cooling, while it was rather small for vascularized water cooling. Finally, the optimization distribution of heat source was numerically conducted to reduce the maximum temperature and maximum temperature difference, and 40 mm *72 mm HPLDA distribution was selected as the best choice. Overall, the advanced vascularized liquid metal convection cooling offers a novel and effective heat dissipation method for the thermal management of HPLDA.
Thermal Effects in High-Power Double Diode-End-Pumped Cs Vapor Lasers

yunfeng liu,bailiang pan,jing yang,yajuan wang,meihua li

DOI: https://doi.org/10.1109/JQE.2012.2185685

2012-01-01

Abstract:Assuming the pump light to be Gaussian beam and considering the nonlinear absorption of the medium, we establish the heat conduction model to describe the thermal effects in a double end-pumped Cs vapor laser. Combined with the experimental parameters, the radial temperature distribution and accordingly the optical path difference under different pump powers are obtained by numerically solving the model. Furthermore, the influence of operating parameters on the thermal focal length is investigated.
Analysis of thermal spreading resistance in high power LED package and its design optimization

Shaojie Dong,Qiang Zhou,Minghua Wang,Xiaoqing Jiang

DOI: https://doi.org/10.1109/ICEPT.2011.6067010

2011-01-01

Abstract:Thermal spreading resistance has a great influence on thermal resistance of LED chip especially in flip chip, and there exists a need for a thermal design optimization of LED package. In this paper, we analyze thermal spreading effect in both flip chip and face-up chip, and get a thermal design optimization of LED package. Firstly, thermal spreading resistance is calculated, and then thermal simulation is done using finite element method. Influencing factors in thermal spreading are analyzed by these two methods and the results are matched quite well. An optimal thickness of heat sink is found, and the minimal thermal resistance of heat sink is attained in this thickness value. The optimal thickness decreases after increasing area of heat source. In flipchip LED, thermal resistance decreases after increasing area of Au bumps and the thickness of PN junction available at the present technology. At the same Au usage, reduce the area of each bump and increase the number of bumps could effectively decrease thermal resistance of PN junction and have good temperature evenness. It is important to consider thermal spreading effect in LED packaging.
Design and Research of Laminated Packaging Structure for Semiconductor Laser Diode

Peidong Xu,Bin Wang,Yang Qian,Yong Wang,Yunjie Teng,Xiantao Wang

DOI: https://doi.org/10.3390/coatings12101450

IF: 3.236

2022-10-02

Coatings

Abstract:The primary factor influencing semiconductor laser performance is photoelectric conversion efficiency. In this study, a heat sink structure in the form of a laminated DC-mount package was created using Solidworks 2018 in accordance with the semiconductor laser C-mount packaging structure specifications. The Workbench 17.0 program theoretically derived the link between the device's junction temperature and power, and then optimized the size of its heat sink. The primary characteristics of semiconductor laser devices with various C-type and DC-type heat sink architectures were then packaged and compared. Results demonstrate that thermal resistance decreased by 31%, the power of the semiconductor laser device with a DC packaging structure increased by 0.5 W, and photoelectric conversion efficiency increased to over 60%, thereby lowering the temperature at the device junction and thermal resistance. at least to a certain point. the effect of the parasitic parameters of the package is effectively improved. Finally, the 3000 h life test confirmed this package construction's stability.

materials science, multidisciplinary,physics, applied, coatings & films
Thermal design for the package of high-power single-emitter laser diodes

Di-Hai Wu,Chung-En Zah,Xingsheng Liu

DOI: https://doi.org/10.1016/j.optlastec.2020.106266

2020-09-01

Abstract:<p>An analytical three-dimensional thermal model is employed to perform the thermal design for the package of high-power single-emitter laser diodes. Thermal design curves for the heat sink and submount are presented in detail, for laser diodes subjected to several convective heat transfer conditions on the bottom of the heat sink. An effective heat spreading angle is proposed to characterize thermal design for the heat sink. A differential heat spreading angle is proposed to clearly manifest heat flow in the packages. Full width and length at 90% energy are introduced to reveal the requirement of submount width and length, respectively. The impact of coefficient of thermal expansion (CTE)-matched sandwiched submount on total heat dissipation is studied. Special discussion is presented for a commercial F-Mount laser diode, and it is found that current heat sink design leads to a 27.4% increase in thermal resistance relative to a free lateral diffusion package.</p>

optics,physics, applied
The Effect of Geometric Parameters on Flow and Heat Transfer Characteristics of a Double-Layer Microchannel Heat Sink for High-Power Diode Laser

Yiwei Gao,Junchao Wang,Mingxuan Cao,Luhao Zang,Hao Liu,Xiaolei Bai,Ying Wang,Matthew M. F. Yuen

DOI: https://doi.org/10.3390/mi13122072

IF: 3.4

2022-11-25

Micromachines

Abstract:The effect of the geometric parameters on the flow and heat transfer characteristics of a double-layer U-shape microchannel heat sink (DL-MCHS) for a high-power diode laser was investigated in this work. FLUENT 19.2 based on the finite volume method was employed to analyze the flow and heat transfer performance of DL-MCHS. A single variable approach was used to fully research the impact of different parameters (the number of channels, the channel cross-sectional shape, and the aspect ratio) on the temperature distribution, pressure drop, and thermal resistance of the DL-MCHS. The rectangular DL-MCHS heat transfer performance and pressure drop significantly increased with the rise in the channel's aspect ratio due to there being a larger wet perimeter and convective heat transfer area. By comparing the thermal resistance of the DL-MCHS at the same power consumption, it was found that the rectangular DL-MCHS with an aspect ratio in the range of 5.1180–6.389 had the best overall performance. With the same cross-sectional area and hydraulic diameter (AC = 0.36 mm, Dh = 0.417 mm), the thermal resistance of the trapezoidal microchannel heat sink was 32.14% and 42.42% lower than that of the triangular and rectangular ones, respectively, under the condition that the pumping power (Wpp) was 0.2 W. Additionally, the thermal resistance was reduced with the increment of the number of channels inside the DL-MCHS, but this would induce an increased pressure drop. Thus, the channel number has an optimal range, which is between 50 and 80 for the heat sinks in this study. Our study served as a simulation foundation for the semiconductor laser double-layer U-shaped MCHS optimization method using geometric parameters.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Design for a highly anti-interference He-Ne laser with novel multi-layer weakly coupled heat dissipation structure

Hongxing Yang,Ziqi Yin,Xinyue Wang,Pengcheng Hu,Ruitao Yang,Haijin Fu,Xu xing,Jiubin Tan

DOI: https://doi.org/10.1016/j.optlastec.2022.108588

2022-09-01

Abstract:A novel multi-layer weakly coupled heat dissipation structure (MWHDS) with a low thermal conductivity layer between the metal layer and the thin-film heater of the laser is proposed. To reduce the influence of large temperature drift on high-precision frequency stabilisation, the anti-interference ability of the traditional strongly coupled water-cooling heat dissipation structure (SWHDS) is analyzed. Comparative simulation results of the aforementioned structures demonstrated that MWHDS has a better anti-interference ability than that of SWHDS. The experiments indicated that the laser with an MWHDS can resist the fluctuations in ambient temperature ( 15°C-32°C ) and the water temperature ( 19.5°C-24.5°C ), respectively, whose frequency stability according to the Allan variance is 2.1×10-11 ( τ=10 s).

optics,physics, applied
Application Research of Phase Change Material Heat Removal Technology for Compact High Efficiency Diode Pumped Laser

Cheng Yong,Guo Yanlong,He Zhizhu,Tan Chaoyong,Liu Xu,Ma Yunfeng,Liu Jing

DOI: https://doi.org/10.3788/cjl201643.0102005

2016-01-01

Abstract:Heat management has become one of the key techniques for diode pumped solid state laser's (DPSSL) performances,such as compact,plug-in efficiency and beam quality.The heat management technology for DPSSL based on low-melting-point Gallium alloys phase change material (PCM) is studied.Experimental result proves that,compared with air-cooled heat radiator,PCM heat radiator can extend laser working hours to six times longer,decrease cooling power to 46％ and radiator's volume to 53％,and improve the plug efficiency from 3.02％ to 3.77％.Furthermore,the finite element software ANSYS has been used to simulate the temperature distribution of PCM radiator.The simulated result indicates that PCM has advantages such as low cooling power and small volume.The results provide the theoretical and experimental basis in laser heat management using liquid metal,and has important engineering application value.
Thermal Analysis of a Novel Compact Packaged Passively Cooled Laser Diode Array

Cong Yin,Lei Huang,Fahong He,Mali Gong

DOI: https://doi.org/10.1109/TCAPT.2008.2001166

2008-01-01

Abstract:The temperature of a laser diode array chip must be maintained under a safe level during operation in order to achieve satisfactory performance and lifetime. In this paper, 3-D thermal analysis on diode heatsink is presented. The boundary condition at the bottom of heatsink is constant convective heat transfer coefficient. In addition, heat transfer in thermal-entry region of tubes is accounted for to calculate the convective heat transfer coefficient. Moreover, a 12 mm times 37 mm times 7 mm passively cooled laser diode array cooled by a base heatsink is demonstrated. Up to 62 W output power with an electrical-to-optical conversion efficiency of 49.2% are achieved. System thermal resistance of 0.77 K/W is obtained when the flow rate through the base heatsink with 0.8-mm-wide, 2-mm-high and 20-mm-long channels is 25 cm3/s.
Micro-structured lateral thermal lens for increased output power and narrowed beam divergence in kilowatt-class 9xx nm diode laser bars

M. J. Miah,D. Martin,A. Ginolas,M. Elattar,P. Della Casa,S. Grützner,S. Strohmaier,A. Knigge,G. Tränkle,P. Crump

DOI: https://doi.org/10.1063/5.0213829

IF: 4

2024-06-10

Applied Physics Letters

Abstract:Local temperature non-uniformity is a critical limit to power in large-area semiconductor lasers, playing a larger role than the conversion efficiency and temperature sensitivity in the most efficient modern devices. For the specific case of kilowatt-level edge-emitting diode laser bars, we demonstrate that laterally re-distributing current locally within each emitter using a customized micro-structuring of the electrical contact can flatten the thermal profile, based on the thermal design using COMSOL. The concept is demonstrated experimentally in adapted bars that contain eight broad-area emitters, each having wide (∼1100 μm) stripes and a 4 mm long resonator. Each emitter in the laser bar has an electrical contact layer that is electrically structured into parallel sub-contacts using implantation, essential to prevent lateral lasing, implemented here with a period of 29 μm. The width of the individual sub-contacts is narrowed in the device center and then monotonically increased toward the emitter edges to collect a higher proportion of heat at the edges, for a fivefold reduction in the thermal lens, despite a significant (20%) overall increase in electrical and thermal resistance. Two performance benefits are observed. First, the slope varies more slowly with average temperature, recovering (here) around half of the efficiency penalty from in-stripe temperature non-uniformity, and hence increasing the power conversion efficiency at 800 W optical output power by around 5%. Second, the lateral far field (95% power content) is narrowed by around 2° at 800 W optical output power, corresponding to a reduction of around half of the thermal contribution.

physics, applied
Thermal Modeling and Analysis of High Power Semiconductor Laser Arrays

Zhiyong Zhang,Pu Zhang,Xiaoning Li,Lingling Xiong,Hui Liu,Zhiqiang Nie,Zhenfu Wang,Xingsheng Liu

DOI: https://doi.org/10.1109/icept-hdp.2012.6474681

2012-01-01

Abstract:With the continuous increase of the output power of semiconductor laser array, the heat generation in the active region also increases continuously, which influences the performances and lifetime of semiconductor laser array seriously. In order to improve the performances and lifetime, understanding of the thermal behavior of high power semiconductor laser array packages and optimizing the thermal performance are crucial. By means of numerical analysis, a three-dimensional thermal model has been established, and the static and transient thermal characteristics in continuous-wave (CW) and quasi-continuous-wave (QCW) modes also have been studied systematically for a hard solder, conduction-cooled-packaged 808nm semiconductor laser array. Based on the thermal modeling and analysis, the approaches to reduce thermal resistance have been proposed. The results show that: compared with copper-tungsten (CuW), adopting the copper-diamond composite material as the submount can decrease the thermal crosstalk behavior between emitters, and reduce the thermal resistance by about 30%. In addition, a novel thermal design for the packaging structure of the mounting heat-sink is demonstrated, which has the ability of reducing the thermal resistance of the devices significantly.
Numerical Research on Microchannel Cooling Structure of High Power Solid-State Lasers

Lu Kunpeng,Liu Zhenyu,Yang Xue,Wang Ke

DOI: https://doi.org/10.3788/cjl202047.0601010

2020-01-01

Chinese Journal of Lasers

Abstract:To develop a new microchannel cooling structure for end-pumped solid-state lasers, the temperature distribution of gain medium and flow resistance in the cooling structure were studied using the fluid-thermal-solid coupled numerical method, which provides a theoretical basis for optimization of the new cooling structure. Results show that there is no obvious decrease in maximum temperature of gain medium when the coolant flow rate increases to 15 L/min, and the flow resistance in the microchannel cooling structure at this flow rate does not dramatically influence the working condition of the cooling system. The inlet and outlet positions of the cooling structure and the flow direction greatly influence the temperature distribution of gain medium.
Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Libin Lu,Zhen Zhang,Yingchun Guan,Hongyu Zheng

DOI: https://doi.org/10.3390/polym10080886

IF: 5

2018-01-01

Polymers

Abstract:Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics.
Optimization design of microchannel heat sink geometry for high power laser mirror

Haishan Cao,Guangwen Chen

DOI: https://doi.org/10.1016/j.applthermaleng.2010.03.022

IF: 6.4

2010-01-01

Applied Thermal Engineering

Abstract:Microchannel heat sink for high power laser mirror with water cooling was analyzed as a function of microchannel geometry and operation parameters. A comparative analysis of the thermal deformation on the mirror surface without cooling and that with cooling revealed that the maximal thermal deformation on the mirror surface could decrease from about 0.115 μm to around 0.040 μm under the laser power of 200 W/cm2 by using microchannel heat sink designed. In order to enhance the performance of microchannel heat sink, the effects of channel width, channel depth, fin width, mirror thickness and cooling region were investigated. The results indicated that the heat transfer performance of the microchannel heat sink could be further improved by narrow and deep channel, narrow fin, thin mirror and large cooling region.
Thermal Performance of Laser Diode Array under Constant Convective Heat Transfer Boundary Condition

Yin Cong,Huang Lei,He Fa-Hong,Gong Ma-Li

DOI: https://doi.org/10.1088/0256-307x/24/7/040

2007-01-01

Abstract:Three-dimensional heat transfer model of laser diode array under constant convective heat transfer coefficient boundary condition is established and analytical temperature profiles within its heat sink are obtained by separation of variables. The influences on thermal resistance and maximum temperature variation among emitters from heat sink structure parameters and convective heat transfer coefficient are brought forward. The derived formula enables the thermal optimization of laser diode array.
Extreme Double/Triple Asymmetric Epitaxial Structure Based Diode Lasers for High Powers and High Efficiencies

Xiaolei Zhao,Siwei Zeng,Lance Sweat,Lin Zhu

DOI: https://doi.org/10.1109/jphot.2022.3176811

IF: 2.4

2022-06-15

IEEE Photonics Journal

Abstract:In edge-emitting high power laser diodes, the longitudinal spatial hole burning (LSHB) effect induced by the inhomogeneous photon and carrier distributions and the non-linear process, two-photon absorption (TPA), are demonstrated to the key causes of power saturation at the high injection level even in the absence of thermal roll-over. Laser diodes based on extreme, double/triple asymmetric (EDAS/ETAS) epitaxial structures show great potentials in high-power and high-efficiency applications owing to the reduced series resistance, low optical loss, and suppressed power saturation. In this paper, a novel semi-analytical calculation method is proposed to systematically analyze the impact of LSHB and TPA effects on the output characteristics of EDAS/ETAS-based broad area lasers (BALs). By leveraging the feature that it is flexible to adjust the confinement factor of ETAS epitaxial structure without compromising the internal loss and resistance level, the laser parameters are first optimized to minimize power saturation of ETAS-based BALs under pulsed and Continuous Wave (CW) operation.

engineering, electrical & electronic,optics,physics, applied
Research on the temperature control strategy of thin-wall parts fabricated by laser direct metal deposition

Tianbiao Yu,Liaoyuan Chen,Zhe Liu,Pengfei Xu

DOI: https://doi.org/10.1007/s00170-022-09895-6

2022-08-16

Abstract:To solve the problem that the macro-size, microhardness, and mechanical properties of the laser direct metal deposition (DMD) of thin-walled parts are inconsistent due to the heat accumulation, an improved three-dimensional finite element heat propagation model was developed to simulate the temperature evolution of the single-pass multi-layer thin-walled parts. The results show that the heat accumulation is contributed to the transformation of the heat dissipation mechanism from three-dimensional to two-dimensional, while the residual heat of the former layer has no significant effect on the heat accumulation of the current layer. The optimized strategy of decreasing laser power gradually is more effective than the optimized strategy of increasing the time interval between layers in maintaining the stability of the molten pool. The integrated optimized strategy of parabolic-shape laser power decreasing and time interval of 5 s is the most effective method to reduce the heat accumulation in the DMD of thin-walled parts. The thin-walled parts with an optimized deposition process have a more uniform width, finer microstructure, and higher microhardness. This work provides theoretical guidance for reducing the heat accumulation during DMD thin-walled parts and is beneficial to improving the uniformity of mechanical properties of thin-walled parts.

engineering, manufacturing,automation & control systems
Computational Modeling and Experimental Validation of Thermal Stress and Melt Pool Characteristics Using High Power Laser Diode Beam on 7075 Aluminum Alloy

A. C. Umamaheshwer Rao,S. M. Shariff,V. Vasu,K. V. Sai Srinadh,P. Venkateshwar Reddy,Vijay Kumar Mahakur

DOI: https://doi.org/10.1007/s11665-024-09921-6

IF: 2.3

2024-08-21

Journal of Materials Engineering and Performance

Abstract:Lazing with a smaller beam causes overlapping of laser tracks, develops unwanted phases at overlapped interface regions, and adversely affects corrosion and mechanical properties. This study employs a finite element method to predict temperature distribution using high-power diode lasers with a 20 × 5 mm rectangular laser beam spot for efficient surface melting of 7075 Al alloy. The analysis focuses on the impact of laser energy density (120, 150, and 200 J/mm 2 ) on cooling rates and surface temperature. The effects of laser energy density for each irradiation spot-on temperature and stress field are investigated using the COMSOL model. Simulation results show a uniformly treated layer without inter-pass tracking effects, and the surface temperature remains above the critical temperature throughout processing for both 120, 150 J/mm 2 laser densities. The simulated melt depth for a sample lased with 150 J/mm 2 (2.45 mm) is shallower than the actual result (2.3 mm), and the simulated sample with 120 J/mm 2 energy density has a melt depth of 2.1 mm compared to the experimental measurement of 1.8 mm, while the sample lased with 200 J/mm 2 results in heavy undulations. A strong correlation is observed between the experimental and the finite element model results. SEM analysis and potentiodynamic polarization tests were also performed to understand microstructure evolution and corrosion behavior in the remelted layers.

materials science, multidisciplinary

[Immediate results in a case of liver cirrhosis treated with neurectomy of hepatic artery].

Analysis of temperature distributions in diode-pumped alkali vapor lasers

Numerical simulation of thermo-mechanical behavior in high power diode laser arrays

Vascularized Liquid Metal Cooling for Thermal Management of Kw High Power Laser Diode Array

Thermal Effects in High-Power Double Diode-End-Pumped Cs Vapor Lasers

Analysis of thermal spreading resistance in high power LED package and its design optimization

Design and Research of Laminated Packaging Structure for Semiconductor Laser Diode

Thermal design for the package of high-power single-emitter laser diodes

The Effect of Geometric Parameters on Flow and Heat Transfer Characteristics of a Double-Layer Microchannel Heat Sink for High-Power Diode Laser

Design for a highly anti-interference He-Ne laser with novel multi-layer weakly coupled heat dissipation structure

Application Research of Phase Change Material Heat Removal Technology for Compact High Efficiency Diode Pumped Laser

Thermal Analysis of a Novel Compact Packaged Passively Cooled Laser Diode Array

Micro-structured lateral thermal lens for increased output power and narrowed beam divergence in kilowatt-class 9xx nm diode laser bars

Thermal Modeling and Analysis of High Power Semiconductor Laser Arrays

Numerical Research on Microchannel Cooling Structure of High Power Solid-State Lasers

Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Optimization design of microchannel heat sink geometry for high power laser mirror

Thermal Performance of Laser Diode Array under Constant Convective Heat Transfer Boundary Condition

Extreme Double/Triple Asymmetric Epitaxial Structure Based Diode Lasers for High Powers and High Efficiencies

Research on the temperature control strategy of thin-wall parts fabricated by laser direct metal deposition

Computational Modeling and Experimental Validation of Thermal Stress and Melt Pool Characteristics Using High Power Laser Diode Beam on 7075 Aluminum Alloy