Electropulsing Aging Treatment of Cu–Ni–Si Sheet for Microforming

Jie Zhu,Yao Lin,Shan Liu,Xudong Lin,Guangchun Wang
DOI: https://doi.org/10.1002/adem.202100249
IF: 3.6
2021-05-02
Advanced Engineering Materials
Abstract:<p>Electropulsing aging treatment (EAT) can achieve a significant increase in the strength and conductivity of the Cu‐Ni‐Si alloy in a short time while maintaining a lower temperature. Compared with the aging treatment of a conventional heating furnace at 450°C for 120 min, the EAT can reach or even exceed the same strength and conductivity in only 5 min. The mechanical and electrical properties of the samples treated with 630 A/mm<sup>2</sup> and 680 A/mm<sup>2</sup> current density were more prominently improved. After 45 min of treatment with 680 A/mm<sup>2</sup> current density, the tensile strength exceeds 600 MPa, and the conductivity reaches 33.45% IACS. TEM and HRTEM observations showed that the main precipitates of EAT sample is <i>δ</i>‐Ni<sub>2</sub>Si nanoscale strengthening phase, and there is also <i>β</i>‐Ni<sub>3</sub>Si phase in the copper matrix. The strengthening mechanism is the localized Joule heating generated by the electropulsing and the kinetic energy conversion caused by drift electrons, which increases the migration rate of solute atoms Si and Ni, and reduces the energy barrier required in the precipitation process, thereby accelerating the formation of precipitates. EAT has the potential to become a new process for the preparation of high strength and high conductivity copper alloys.</p><p>This article is protected by copyright. All rights reserved.</p>
materials science, multidisciplinary
What problem does this paper attempt to address?