Microstructure Evolution of Copper Strips with Gradient Temperature in Electropulsing Treatment

R. F. Zhu,G. Y. Tang,S. Q. Shi,M. W. Fu
DOI: https://doi.org/10.1016/j.jallcom.2013.07.017
IF: 6.2
2013-01-01
Journal of Alloys and Compounds
Abstract:Microstructure evolution of copper strips with gradient temperature between two electrodes in electro-pulsing treatment is investigated. The cold-rolled copper strips develop recovery and recrystallization between the two electrodes. The gradient temperature caused by the movement of strips in the treatment process results in the evolution of microstructure. The larger temperature gradient distribution caused by the electropulsing treatment with higher frequency, the larger microstructure evolution the copper strips have, indicating the temperature plays an important role in electropulsing treatment. (C) 2013 Elsevier B.V. All rights reserved.
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