Low-dielectric flame-resistant adhesive composition

薗田辽,伊藤武,三上忠彦
2016-10-26
Abstract:Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solder heat resistance and has excellent low-dielectric characteristics and flame resistance. This laminate (Z) is obtained by stacking a resin substrate and a metal substrate with an adhesive layer therebetween, the adhesive layer comprising a carboxyl-containing polyolefin resin (A). The laminate (Z) is characterized in that: (1) the adhesive layer has a specificpermittivity (epsilon c) of at most 3.0 at the frequency of 1 MHz; (2) the adhesive layer has a dielectric tangent (tan delta) of at most 0.02 at the frequency of 1 MHz; (3) the peel strength of the resin substrate and the metal substrate is at least 0.5 N/mm; (4) the laminate (Z) has a moist solder heat resistance of at least 240 DEG C; and (5) a laminate (X) of the adhesive layer and the resin substrate indicates VTM-0 by UL-94 standard.
Materials Science,Engineering
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