Silicide‐Silicon Interface Degradation during Titanium Silicide/Polysilicon Oxidation

M. Tanielian,R. Lajos,S. Blackstone,D. Pramanik
DOI: https://doi.org/10.1149/1.2114143
IF: 3.9
1985-06-01
Journal of The Electrochemical Society
Abstract:We have investigated the silicide‐silicon interface during the oxidation of titanium silicide on polysilicon. We find that during oxidation the polysilicon layer under the silicide is consumed inhomogeneously and that at the same time the titanium silicide moves into the polysilicon layer. Oxidations were carried out both in wet and dry O2 with similar results. This nonuniform consumption of the polysilicon layer appears to be related to the condition of the silicide‐silicon interface prior to the oxidation step. This effect can result in the reduction of the dielectric breakdown strength of underlying gate oxide in titanium silicide/polysilicon/oxide/Si structures.
electrochemistry,materials science, coatings & films
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