Preparation process for high-entropy alloy coatings based on electroless plating and thermal diffusion

Guixin Dai,Shiping Wu,Xixi Huang
DOI: https://doi.org/10.1016/j.jallcom.2022.163736
IF: 6.2
2022-05-01
Journal of Alloys and Compounds
Abstract:In the paper, the preparation process for high-entropy alloy coatings in the field of electroless plating was explored. According to the method for designable alloy coatings, Al-induced electroless plating was used to create multilayer coatings. The thermal diffusion process was used to alloy the multilayer coatings. Therefore, multilayer coatings as a predesigned basic material for alloy coatings needed to be discussed first. Then, the alloying process of high-entropy alloy coatings was primarily investigated. In this paper, the CuCoNi alloy coating was the main object of research. The alloying process was characterised and analysed by scanning electron microscopy and X-ray diffraction. The corrosion resistance of the coating was measured by electrochemical tests. The results show that the element distribution and the phase peaks of the multilayer coatings gradually became homogeneous and stable during thermal diffusion. The alloying process was confirmed by these changes in morphology and structure. Alloy coatings were created with controlled element types and element proportions in electroless plating. The element types of the coatings can be controlled by the deposition composition, and the element proportions can be controlled by the deposition thickness. The corrosion resistance of the alloy coating was better than that of the single-element coating. At 6 h of thermal diffusion (which is the optimum diffusion time for the CuCoNi alloy coating), the corrosion potential was − 0.218 V, and the corrosion current density was 2.72 μA/cm2. Based on the preparation process results, the design methods for high-entropy alloy coatings were proposed.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
What problem does this paper attempt to address?