Towards Intelligent Cooperative Robotics in Additive Manufacturing: Past, Present and Future

Sean Rescsanski,Rainer Hebert,Azadeh Haghighi,Jiong Tang,Farhad Imani
2024-08-09
Abstract:Additive manufacturing (AM) technologies have undergone significant advancements through the integration of cooperative robotics additive manufacturing (C-RAM) platforms. By deploying AM processes on the end effectors of multiple robotic arms, not only are traditional constraints such as limited build volumes circumvented, but systems also achieve accelerated fabrication speeds, cooperative sensing capabilities, and in-situ multi-material deposition. Despite advancements, challenges remain, particularly regarding defect generation including voids, cracks, and residual stress. Various factors contribute to these issues, including toolpath planning (i.e., slicing strategies), part decomposition for cooperative printing, and motion planning (i.e., path and trajectory planning). This review first examines the critical aspects of system control for C-RAM systems comprised of slicing and motion planning. The methods for the mitigation of defects through the adjustment of these aspects and the process parameters of AM methods are then described in the context of how they modify the AM process: pre-process, inter-layer (i.e., during layer pauses), and mid-layer (i.e., during material deposition). The application of advanced sensing technologies, including high-resolution cameras, laser scanners, and thermal imaging, to facilitate the capture of micro, meso, and macro-scale defects is explored. The role of digital twins is analyzed, emphasizing their capability to simulate and predict manufacturing outcomes, enabling preemptive adjustments to prevent defects. Finally, the outlook and future opportunities for developing next-generation C-RAM systems are outlined.
Robotics
What problem does this paper attempt to address?
The paper primarily explores issues related to the use of collaborative robot (C-RAM) platforms in additive manufacturing (AM) and proposes future development directions. Specifically, the paper aims to address the following key issues: 1. **Improving Print Quality**: Although the C-RAM platform can achieve faster printing speeds, enhanced sensing capabilities, and multi-material deposition, there are still some defects in the printing process, such as porosity, cracks, and residual stress. The paper discusses in detail methods to reduce these defects by adjusting slicing strategies, path planning, and process parameters. 2. **System Control Methods**: The paper first reviews the crucial system control methods in the C-RAM system, including slicing (i.e., tool path planning) and motion planning. These methods are essential for achieving high-quality part printing. 3. **Process Control Methods**: The paper introduces process control methods to mitigate defects through three control levels (pre-processing, inter-layer processing, and intra-layer processing) and explores how to use advanced sensing technologies (such as high-resolution cameras, laser scanners, and thermal imaging) to detect micro, meso, and macro defects. 4. **Application of Digital Twin**: The paper analyzes the role of digital twins in predicting manufacturing outcomes, emphasizing their ability to simulate and predict manufacturing results, thereby allowing for adjustments during the manufacturing process to prevent defects. 5. **Future Development Directions**: Finally, the paper outlines the prospects and opportunities for developing the next generation of C-RAM systems, particularly by improving slicing methods, motion planning, and sensing technologies to further enhance print quality and efficiency. Overall, this paper aims to comprehensively assess the challenges of current C-RAM systems and propose solutions to drive future development in this field.