Abstract:Future far-infrared astrophysics observatories will require focal plane arrays containing thousands of ultra-sensitive, superconducting detectors, each of which needs to be optically coupled to the telescope. At longer wavelengths, many approaches have been developed including feedhorn arrays and macroscopic arrays of lenslets. However, with wavelengths as short as 25 microns, optical coupling in the far-infrared remains challenging. In this paper, we present a novel approach for fabricating far-infrared monolithic silicon microlens arrays using grayscale lithography and deep reactive ion etching. The design, fabrication, and characterization of the microlens arrays are discussed. We compare the designed and fabricated lens profile, and calculate that the fabricated lenses will achieve 84% encircled power for the designed detector, which is only 3% less than the designed performance. We also present methods developed for anti-reflection coating microlens arrays and for a silicon-to-silicon die bonding process to hybridize microlens arrays with detector arrays.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is how to efficiently couple the telescope optical system with the superconducting detector array in far - infrared astrophysics observations. Specifically, as the wavelength shortens to around 25 micrometers, traditional optical coupling techniques (such as horn arrays and macroscopic lens arrays) encounter challenges in the far - infrared band. To address this problem, the author proposes a new method, that is, using grayscale lithography and deep - reactive - ion - etching (DRIE) techniques to fabricate monolithic silicon microlens arrays. ### Main Problems 1. **Efficient Optical Coupling**: - Future far - infrared astronomical observations require focal - plane arrays containing thousands of ultrasensitive superconducting detectors, and each detector needs to be efficiently coupled with the pre - telescope optical system. - At shorter wavelengths (such as 25 micrometers), optical coupling becomes particularly difficult. 2. **Limitations of Existing Technologies**: - Existing technologies such as horn arrays, macroscopic numbers of lens arrays, etc., face technical challenges when the wavelength is as short as 25 micrometers, such as problems with surface roughness and pixel placement accuracy. ### Solutions - **Grayscale Lithography and Deep - Reactive - Ion - Etching (DRIE)**: - Using grayscale lithography technology can define precise three - dimensional photoresist profiles, and then transfer these profiles onto a silicon substrate through DRIE, thereby fabricating microlenses with sufficiently smooth and accurate profiles. - This method can produce monolithic silicon microlens arrays suitable for the far - infrared band (25 - 240 micrometers). These microlenses have a depth of up to 150 micrometers, are arranged hexagonally, have a pixel pitch of 900 micrometers, and an overall size of up to 80×15 millimeters. 3. **Anti - reflection Coatings and Hybrid Bonding**: - A method for anti - reflection coatings for microlens arrays has been developed, as well as a hybrid bonding process between silicon wafers, in order to integrate the microlens array with the detector array. ### Results - **Optical Performance Evaluation**: - The fabricated microlens array is very close to the designed lens profile. Calculation results show that the fabricated lens can achieve 84% of the encircled energy, which is only 3% lower than the designed performance. - The surface roughness has reached the sub - micrometer level, meeting the requirements for a 25 - micrometer wavelength. Through this method, the author demonstrates how to fabricate an efficient microlens array suitable for the far - infrared band and overcomes the limitations of traditional techniques at short wavelengths.

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