Abstract:For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor increase hotspots and demand careful consideration of thermal management at all levels of integration [4] as stacked transistors are detached from the substrate (i.e., heat sink). Traditional system level approaches such as liquid cooling [5], heat spreader [6], etc. are inadequate for transistor level 3-D integration and have huge cost overhead [7]. In this paper, we investigate the thermal profile for transistor level 3-D integration approaches through finite element based modeling. Additionally, we propose generic physical level heat management features for such transistor level 3-D integration and show their application through detailed thermal modeling and simulations. These features include a thermal junction and heat conducting nano pillar. The heat junction is a specialized junction to extract heat from a selected region in 3-D; it allows heat conduction without interference with the electrical activities of the circuit. In conjunction with the junction, our proposed thermal pillars enable heat dissipation through the substrate; these pillars are analogous to TSVs/Vias, but carry only heat. Such structures are generic and is applicable to any transistor level 3-D integration approaches. We perform 3-D finite element based analysis to capture both static and transient thermal behaviors of 3-D circuits, and show the effectiveness of heat management features. Our simulation results show that without any heat extraction feature, temperature for 3-D integrated circuits increased by almost 100K-200K. However, proposed heat extraction feature is very effective in heat management, reducing temperature from heated area by up to 53%.

Anisotropic thermal conductivity of high bandwidth memory

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Parallel Simulation of Fully Coupled Electrothermal Processes in Large-Scale Phase-Change Memory Arrays

Modeling and Simulation of an Improved Resistive Random Access Memory Array

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

Fully Coupled Electrothermal Simulation of Resistive Random Access Memory (RRAM) Array

Multiphysics Simulation of Multifilamentary Conduction Resistive Random Access Memory

Electrothermal Simulation of Resistive Random Access Memory(RRAM) Array Using Finite Difference Method

Electrothermal Investigation on Vertically Aligned Single-Walled Carbon Nanotube Contacted Phase-Change Memory Array for 3-D ICs

A Novel Methodology for Thermal Analysis & 3-Dimensional Memory Integration

A New Analytical Electro-Thermal Model in 3D Resistive Switching Memory Arrays

Thermal Effect on Endurance Performance of 3-Dimensional Rram Crossbar Array

Interface controlled thermal resistances of ultra-thin chalcogenide-based phase change memory devices

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Thermal Management in Fine-Grained 3-D Integrated Circuits

Interface controlled thermal properties of ultra-thin chalcogenide-based phase change memory devices

Thermal Conductivity Measurement of Amorphous Dielectric Multilayers for Phase-Change Memory Power Reduction

Thermal Crosstalk in 3-Dimensional RRAM Crossbar Array

Multi-Scale Thermal Modeling of RRAM-based 3D Monolithic-Integrated Computing-in-Memory Chips

Understanding of Thermal Engineering for Vertical Nanowire Phase-Change Random Access Memory Partially Wrapped by Low-Conductivity Layer

Thermal analysis & optimization of a 3 dimensional heterogeneous structure