Thermoelastic Damping in MEMS Gyroscopes at High Frequencies

Daniel Schiwietz,Eva M. Weig,Peter Degenfeld-Schonburg

DOI: https://doi.org/10.1038/s41378-022-00480-1

2024-01-26

Abstract:Microelectromechanical systems (MEMS) gyroscopes are widely used, e.g. in modern automotive and consumer applications, and require signal stability and accuracy in rather harsh environmental conditions. In many use cases, device reliability must be guaranteed under large external loads at high frequencies. The sensitivity of the sensor to such external loads depends strongly on the damping, or rather quality factor, of the high frequency mechanical modes of the structure. In this paper, we investigate the influence of thermoelastic damping on several high frequency modes by comparing finite element simulations with measurements of the quality factor in an application-relevant temperature range. We measure the quality factors over different temperatures in vacuum, to extract the relevant thermoelastic material parameters of the polycrystalline MEMS device. Our simulation results show a good agreement with the measured quantities, therefore proving the applicability of our method for predictive purposes in the MEMS design process. Overall, we are able to uniquely identify the thermoelastic effects and show their significance for the damping of the high frequency modes of an industrial MEMS gyroscope. Our approach is generic and therefore easily applicable to any mechanical structure with many possible applications in nano- and micromechanical systems.

Mesoscale and Nanoscale Physics

What problem does this paper attempt to address?

The paper primarily explores the effect of Thermoelastic Damping (TED) in Micro-Electro-Mechanical Systems (MEMS) gyroscopes under high-frequency conditions. Specifically, the main objectives of the study include:

1. **Understanding the impact of thermoelastic damping on high-frequency modes**: The researchers focus on the performance of MEMS gyroscopes under high-frequency conditions, particularly their sensitivity to environmental vibrations. High-frequency modes are crucial for the sensor's response to external loads, and the characteristics of these modes are determined by their Quality Factor (Q-factor).

2. **Quantifying the contribution of thermoelastic damping**: By comparing experimental measurements with finite element simulations, the researchers aim to quantify the contribution of thermoelastic damping to the Q-factor of high-frequency modes under different temperature conditions. They particularly focus on the thermoelastic damping effect in high-frequency modes of industrial-grade MEMS gyroscope designs and demonstrate that this approach can be used to predict damping behavior during the MEMS design process.

3. **Validating the effectiveness of the simulation method**: The researchers developed an effective simulation method based on the Finite Element Method (FEM) to evaluate thermoelastic damping. This method is used to predict the Q-factor at different frequencies and its accuracy is validated through experimental data.

4. **Extracting material parameters**: To accurately simulate thermoelastic damping, the researchers need to consider temperature-dependent material properties, such as the coefficient of thermal expansion, thermal conductivity, and specific heat capacity. Therefore, the study also aims to determine the variation of these material parameters with temperature.

5. **Improving the reliability of MEMS design**: The ultimate goal is to enhance the reliability of MEMS gyroscope designs, especially in automotive and consumer electronics applications, ensuring that the devices can operate stably under harsh environmental conditions.

In summary, the focus of this paper is to deeply investigate the impact of thermoelastic damping on high-frequency MEMS gyroscope modes and to develop effective methods to predict this impact, thereby improving the reliability and stability of such devices in practical applications.