Carrier Recombination Processes in GaAs Wafers Passivated by Wet Nitridation
Xianshao Zou,Chuanshuai Li,Xiaojun Su,Yuchen Liu,Daniel Finkelstein-Shapiro,Wei Zhang,Arkady Yartsev
DOI: https://doi.org/10.1021/acsami.0c04892
2020-05-29
Abstract:As one of the successful approaches to GaAs surface passivation, wet-chemical nitridation is applied here to relate the effect of surface passivation to carrier recombination processes in bulk GaAs. By combining time-resolved photoluminescence and optical pump—THz probe measurements, we found that surface hole trapping dominates the decay of photoluminescence, while photoconductivity dynamics is limited by surface electron trapping. Compared to untreated sample dynamics, the optimized nitridation reduces hole- and electron-trapping rate by at least 2.6 and 3 times, respectively. Our results indicate that under ambient conditions, recovery of the fast hole trapping due to the oxide regrowth at the deoxidized GaAs surface takes tens of hours, while it is effectively inhibited by surface nitridation. Our study demonstrates that surface nitridation stabilizes the GaAs surface via reduction of both electron- and hole-trapping rates, which results in chemical and electronical passivation of the bulk GaAs surface.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.0c04892.Experimental details; PL emissions and absolute PLQY of naturally oxidized, deoxidized, and nitrided GaAs samples; TRPL and TRTS kinetics of naturally oxidized and deoxidized GaAs under varied excitation fluence; photoconductivity of naturally oxidized, deoxidized, and nitrided GaAs samples at varied excitation fluence; fitting parameters in Figures 3c, 4b, and 6 (PDF).This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology