Highly Effective Transfer of Micro-LED Pixels to Intermediate and Rigid Substrate with Weak and Tunable Adhesion by Thiol Modification
Kui Pan,Jie Sun,Chang Lin,Xiao Li,Yang Li,Qun Yan,Li ying Deng,Zuo dong Mao,Tian xi Yang,Zhong hang Huang,Jun yang Nie,tailiang guo
DOI: https://doi.org/10.1039/d2nr06021c
IF: 6.7
2023-01-17
Nanoscale
Abstract:Based on transfer printing technology, Micro-LED pixels can be transferred to different types and sizes of driver substrates to realize the display of different application scenarios. To achieve a successful transfer, GaN-based Micro-LEDs first need to be separated from the original epitaxial substrate. Here, Micro-LED pixels (each size 25 μm× 30 μm) on the sapphire substrate were transferred to a flexible Semiconductor Wafer Processing (SWP) tape that is strong sticky by conventional laser lift-off (LLO) techniques. The pixels on the SWP tape were then transferred by using a sacrificial layer of non-crosslinked oligomeric polystyrene (PS) film onto the intermediate and rigid substrate (IRS) with weak and tunable adhesion by thiol (-SH) modification. The electrodes of the Micro-LED are Au metal, which form Au-S bonds with the surface of the IRS to fix the pixels. The rigid substrate help ensure that pixels spacing is almost unchanged during the stamp transfer process, and the weak and tunable adhesion facilitates the pixels being picked up by the stamp. The experimental results demonstrate that the pixels can be efficiently transferred to IRS by LLO and sacrificial layer-assistance, which will provide the possibility to achieve the further transfer of pixels to different types and sizes of driver substrates by a suitable transfer stamp. The transfer process details are discussed, which can provide insights into the transfer of micro-nano devices through polymer sacrificial layers.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry