Abstract:VLSI mask optimization is one of the most critical stages in manufacturability aware design, which is costly due to the complicated mask optimization and lithography simulation. Recent researches have shown prominent advantages of machine learning techniques dealing with complicated and big data problems, which bring potential of dedicated machine learning solution for DFM problems and facilitate the VLSI design cycle. In this paper, we focus on a heterogeneous OPC framework that assists mask layout optimization. Preliminary results show the efficiency and effectiveness of proposed frameworks that have the potential to be alternatives to existing EDA solutions.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is how to use machine - learning techniques to improve efficiency and effectiveness in VLSI (Very - Large - Scale Integration) mask optimization. Specifically, the paper explores how to construct a heterogeneous optical proximity correction (OPC) framework. This framework identifies the best OPC engine for a given design through a deterministic machine - learning model, thereby accelerating the mask layout optimization process and reducing the need for expensive lithography simulations. The goal of the paper is to develop a method that can combine the advantages of inverse lithography technology (ILT) and model - based OPC while maintaining a low model prediction cost to promote the VLSI design cycle. The main contributions of the paper include: 1. Investigating the recent progress in deterministic machine - learning - model - assisted printability estimation and the contribution of generative models to direct printable mask synthesis. 2. Proposing a heterogeneous OPC process in which a deterministic machine - learning model determines the appropriate OPC engine for a given pattern. 3. Experimental results show that the proposed framework can take advantage of ILT and model - based OPC with almost no increase in model prediction cost. These contributions aim to solve the problems of high computational resource consumption, high cost, and high complexity in the current VLSI mask optimization process. By introducing machine - learning techniques, especially in deep learning, the efficiency and effectiveness of mask optimization are improved.

VLSI Mask Optimization: From Shallow To Deep Learning

Delving Deeper into Mask Utilization in Video Object Segmentation

DAMO: Deep Agile Mask Optimization for Full Chip Scale

Methodologies for Layout Decomposition and Mask Optimization: A Systematic Review.

Accelerating Chip Design with Machine Learning: from Pre-Silicon to Post-Silicon

Inverse Lithography Physics-informed Deep Neural Level Set for Mask Optimization

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Deep Learning for Mask Synthesis and Verification: A Survey.

Machine Learning for Mask/wafer Hotspot Detection and Mask Synthesis

AdaOPC 2.0: Enhanced Adaptive Mask Optimization Framework for Via Layers

A self-training end-to-end mask optimization framework based on semantic segmentation network

Automated Lithography Resolution Enhancement with Deep Learning Enabled Layout Modification During Physical Design Stage

Machine Learning for Yield Learning and Optimization

Source and Mask Co-Optimization Using A Gradient Based Method in Optical Lithography

AdaOPC: A Self-Adaptive Mask Optimization Framework For Real Design Patterns

Gradient-Based Source And Mask Optimization In Optical Lithography

Efficient ILT via Multi-level Lithography Simulation.

Fast Level-Set-Based Inverse Lithography Algorithm for Process Robustness Improvement and Its Application

ILILT: Implicit Learning of Inverse Lithography Technologies

DMD maskless lithography optimization based on an improved genetic algorithm

Ultra-Fast Source Mask Optimization via Conditional Discrete Diffusion