A resveratrol based active ester cured epoxy film with low dielectric loss and high thermal performances

Zhixi Zhao,Xiang Wang,Jizhen Tian,Yunfei Gao,Fei Chen,Shuai Li,Huawei Zou,Pengbo Liu

DOI: https://doi.org/10.1016/j.porgcoat.2023.107811

IF: 6.6

2023-07-17

Progress in Organic Coatings

Abstract:The production of epoxy resins with low dissipation factor ( D f ) remains an alluring yet challenging task. In this work, we successfully synthesized a novel resveratrol based active ester (ResE) by a one-step method using the renewable resveratrol as raw material. The structure of ResE was characterized using FTIR and NMR techniques. The phenol biphenyl epoxy (SQXN-324) was cured with ResE, the SQXN/ResE system boasted a favorable dielectric constant ( D k ) of 2.78 and dissipation factor ( D f ) of 3.5 × 10 −3 at a high frequency of 10 GHz. Additionally, the SQXN/ResE system exhibited impressive thermal performances, with a 5 % weight loss temperature ( T 5% ) of 368 °C, a residual carbon of 34 wt% at 800 °C in N 2 atmosphere, a glass transition temperature ( T g ) of 154 °C, a coefficient of thermal expansion (CTE) of 61.9 ppm/°C from 25 °C to T g and the CTE of 130 ppm/°C from T g to 250 °C. These findings suggested that a biomass curing agent for epoxy with low D f and high thermal performances were successfully developed, it had potential applications in the high frequency communication field and microelectronics industry.

materials science, coatings & films,chemistry, applied