A renewable resveratrol-based epoxy resin with high Tg, excellent mechanical properties and low flammability

Yazhou Tian,Qiong Wang,Lijiao Shen,Zhichao Cui,Liangliang Kou,Jue Cheng,Junying Zhang
DOI: https://doi.org/10.1016/j.cej.2019.123124
IF: 15.1
2020-03-01
Chemical Engineering Journal
Abstract:Preparing low-flammable biobased epoxy resins with a high glass transition temperature (T g) and excellent mechanical properties is significant for the rapid growing electronics and microelectronics industry. In this research, a resveratrol-based epoxy resin (REEP) with well-designed chemical structures possessing trifunctional epoxy groups and rigid conjugate structures was prepared through the one-pot method and was then cured by methyl hexahydrophthalic anhydride (MeHHPA). The conventional petroleum-based epoxy resin (DGEBA) was cured by the same kind of curing agent. Results showed that T g of REEP/MeHHPA was up to 210.8 °C, much higher than that of DGEBA/MeHHPA (only 146.5 °C). The tensile strength and modulus of REEP/MeHHPA were 73.5 MPa and 3.0 GPa, respectively. More importantly, REEP/MeHHPA exhibited exceptional low permittivity (about 3.5) and low flammability with high char yield of 19.0% (800 °C). Therefore, the resveratrol-based epoxy resin could be a promising candidate for DGEBA and has great potential application in electronics and microelectronics industry.
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