Abstract:This work employs an in‐situ growth method to load layered double hydroxides (LDH) onto transition metal carbides (MXene), synthesizing a novel electronic packaging material (MXene@LDH). The opimized MXene@LDH shows a remarkable minimum reflection loss (RL) of −52.064 dB and a maximum effective absorption bandwidth (EAB) of 4.5 GHz with high thermal conductivity and flame retardancy. Due to the increased integration and miniaturization of electronic devices, traditional electronic packaging materials, such as epoxy resin (EP), cannot solve electromagnetic interference (EMI) in electronic devices. Thus, the development of multifunctional electronic packaging materials with superior electromagnetic wave absorption (EMA), high heat dissipation, and flame retardancy is critical for current demand. This study employs an in‐situ growth method to load layered double hydroxides (LDH) onto transition metal carbides (MXene), synthesizing a novel composite material (MXene@LDH). MXene@LDH possesses a sandwich structure and exhibits excellent EMA performance, thermal conductivity, and flame retardancy. By adjusting the load of LDH, under the synergistic effect of multiple factors, such as dielectric and polarization losses, this work achieves an EMA material with a remarkable minimum reflection loss (RL) of −52.064 dB and a maximum effective absorption bandwidth (EAB) of 4.5 GHz. Furthermore, MXene@LDH emerges a bridging effect in EP, namely MXene@LDH/EP, leading to a 118.75% increase in thermal conductivity compared to EP. Simultaneously, MXene@LDH/EP contributes to the enhanced flame retardancy compared to EP, resulting in a 46.5% reduction in the total heat release (THR). In summary, this work provides a promising candidate advanced electronic packaging material for high‐power density electronic packaging.

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