Abstract:The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried electrode dielectrophoresis (DEP). This process enables to monitor the precise spatial localization of a high density of CNTs and their alignment in a pre-defined direction. Large arrays of independent and low resistivity (4.4 x 10^-5 {\Omega}.m) interconnections were achieved using this hybrid assembly with double-walled carbon nanotubes (DWNT). Finally, arrays of suspended individual CNT carpets have been realized and we demonstrate their potential use as functional nano-electromechanical systems (NEMS) by monitoring their resonance frequencies (ranging between 1.7 MHz to 10.5MHz) using a Fabry-Perot interferometer.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the challenges of carbon nanotubes (CNTs) in large - scale integration into electronic and electromechanical systems. Specifically, the authors proposed a new carbon nanotube integration process. By combining capillary assembly and buried - electrode dielectrophoresis (DEP), precise spatial positioning and directional alignment of carbon nanotubes on the wafer scale were achieved. ### Detailed description of the problem 1. **Challenges of large - scale integration**: - Due to their unique physical properties, carbon nanotubes have broad application potential in fields such as nanoelectronics, gas sensors, infrared sensors, and nano - electromechanical systems (NEMS). - However, large - scale integration of these devices remains a research hotspot, and efficient processing techniques need to be developed. - In particular, when it is compatible with complementary metal - oxide - semiconductor (CMOS) manufacturing technology, the back - end processing temperature cannot exceed 400 - 450°C, which imposes strict requirements on the growth conditions of carbon nanotubes. 2. **Limitations of existing methods**: - The method of directly growing carbon nanotubes on the wafer can control their structural quality but is limited by high - temperature conditions. - Externally synthesized carbon nanotubes can obtain high - quality samples through selective separation, but lack effective wafer - level integration methods. - Although the current dielectrophoresis (DEP) technology can achieve selective deposition and directional alignment, the electrodes serve as both assembly and driving electrodes simultaneously, which limits the flexibility of practical applications. ### Solution The authors proposed a new method based on capillary assembly and buried - electrode dielectrophoresis to solve the above problems: - **Capillary assembly**: Use capillary forces to concentrate carbon nanotubes in specific areas to form a high - density nanotube layer. - **Buried - electrode dielectrophoresis**: Through the action of a non - uniform electric field, make carbon nanotubes align along the direction of the electric field lines and assemble at predefined positions. - **Electrical insulation design**: Throughout the process, carbon nanotubes are kept electrically insulated from DEP electrodes to avoid the influence of electrochemical reactions. - **Independent connection**: Finally, through a separate metallization step, independent connections at each assembly site are achieved to ensure that the design is not restricted. Through this method, the authors successfully achieved the integration of a dense and oriented carbon nanotube layer on the wafer scale and demonstrated its application potential in functional nano - electromechanical systems (NEMS). ### Conclusion This research provides an effective and flexible technical means for the large - scale integration of carbon nanotubes, especially having important significance in wafer - level manufacturing.

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