Intentional Oxidation and Laser Remelting of Highly Reflective Pure Cu for Its High‐Quality Additive Manufacturing

Rui Nan Gu,Peng Chen,Ying Hao Zhou,Hui Wang,Xing Chen Yan,Kam Sing Wong,Ming Yan
DOI: https://doi.org/10.1002/adem.202101138
IF: 3.6
2021-11-18
Advanced Engineering Materials
Abstract:Laser processing of pure Cu is often challenging because of Cu's very low absorptivity to most laser beams, and this difficulty is applicable to the recently developed laser powder bed fusion (LPBF) additive manufacturing (AM). How to realize high‐quality LPBF forming is urgently pursued to maximize its advanced manufacturing potential in directly making various Cu parts. Herein, two approaches have been applied, individually or simultaneously, to address the poor printability problem of the pure Cu: one is to conduct intentional oxidation treatment to the pure Cu powder to vary its surface structure and then enhance its laser absorptivity; and the other is to adopt laser remelting to counter its high thermal conductivity and provide extra liquid phase for better densification. Various research means were used to investigate mechanical performances, microstructural details, and electrical performance of the as‐printed Cu. Results show that a maximum relative density of ≈99.0% can be realized by using the two approaches simultaneously, while oxidation temperature and remelting times are the two important factors to be considered. The methodology developed in this study is expected to be applicable to other highly reflective materials as well. Cu powder is intentionally oxidized to vary its surface structure and enhance its laser absorptivity and then manufactured by laser powder bed fusion additive manufacturing. Laser remelting is adopted to counter high thermal conductivity of Cu and provide extra liquid phase for better densification. Densified samples with good electrical conductivity and tensile strengths are achieved.
materials science, multidisciplinary
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