Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules

Hyeon-Tae Kim,Dong-Bok Lee,Kwan-Soo Lim,Ji-Hyung Lee,Semin Park,Chul-Min Oh,Jeong-Won Yoon
DOI: https://doi.org/10.1007/s10854-024-13371-0
2024-08-22
Journal of Materials Science Materials in Electronics
Abstract:The reliability of terminal–substrate bonding in power modules for electric vehicles (EVs) was investigated by evaluating the effects of bonding method and substrate surface finish on the microstructural and mechanical properties of the joint. Ceramic substrates with bare Cu, electroless Ag, or electroless Ni-immersion Au surface finishes were bonded to Cu terminals by reflow soldering or ultrasonic welding. The interfacial intermetallic compound layers of the reflow-soldered joints exhibited varying compositions and morphologies according to the substrate surface finish, leading to differences in the shear strengths of the terminal joints. In contrast, the ultrasonic-welded joints did not exhibit any significant differences in morphology according to surface finish. Therefore, an electron backscatter diffraction analysis was conducted to observe the ultrasonic-welded joints in more detail. The results indicated that ultrasonic welding caused dynamic recrystallization (DRX) at the interface between the Cu terminal and ceramic substrate, resulting in grain refinement, and that the bare Cu substrate exhibited greater DRX than the other substrates. Consequently, both the bonding method and substrate surface finish were determined to significantly affect the mechanical properties of the power module terminal bond. This study is expected to contribute valuable insights to inform the improvement of terminal bonding for power modules, especially in EV applications.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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