Abstract:Interface layers between reactive and energetic materials in nanolaminates or nanoenergetic materials are believed to play a crucial role in the properties of nanoenergetic systems. Typically, in the case of Metastable Interstitial Composite nanolaminates, the interface layer between the metal and oxide controls the onset reaction temperature, reaction kinetics, and stability at low temperature. So far, the formation of these interfacial layers is not well understood for lack of in situ characterization, leading to a poor control of important properties. We have combined in situ infrared spectroscopy and ex situ X-ray photoelectron spectroscopy, differential scanning calorimetry, and high resolution transmission electron microscopy, in conjunction with first-principles calculations to identify the stable configurations that can occur at the interface and determine the kinetic barriers for their formation. We find that (i) an interface layer formed during physical deposition of aluminum is composed of a mixture of Cu, O, and Al through Al penetration into CuO and constitutes a poor diffusion barrier (i.e., with spurious exothermic reactions at lower temperature), and in contrast, (ii) atomic layer deposition (ALD) of alumina layers using trimethylaluminum (TMA) produces a conformal coating that effectively prevents Al diffusion even for ultrathin layer thicknesses (∼0.5 nm), resulting in better stability at low temperature and reduced reactivity. Importantly, the initial reaction of TMA with CuO leads to the extraction of oxygen from CuO to form an amorphous interfacial layer that is an important component for superior protection properties of the interface and is responsible for the high system stability. Thus, while Al e-beam evaporation and ALD growth of an alumina layer on CuO both lead to CuO reduction, the mechanism for oxygen removal is different, directly affecting the resistance to Al diffusion. This work reveals that it is the nature of the monolayer interface between CuO and alumina/Al rather than the thickness of the alumina layer that controls the kinetics of Al diffusion, underscoring the importance of the chemical bonding at the interface in these energetic materials.

Interface asymmetry and phase transformation of the Cu layer-inserted Al/Cu/Ni/Cu multilayers

Modifying Element Diffusion Pathway by Transition Layer Structure in High-Entropy Alloy Particle Reinforced Cu Matrix Composites

Effect of deposition substrates on surface topography, interface roughness and phase transformation of the Al/Ni multilayers

Multi-component Phase-Field Simulation of Microstructural Evolution and Elemental Distribution in Fe–Cu–Mn–Ni–Al Alloy

Phase Equilibria of the Ternary Ag-Cu-Ni System and the Interfacial Reactions in the Ag-Cu/Ni Couples

Influence of Crystalline Structure on Diffusion Barrier Property of Electroless Ni–Fe–P Coatings in Zn–Al Solder Interconnects

Thermal stability of immiscible Cu-Ag/Fe triphase multilayers with triple junctions

Formation of metastable phases and their effect on the magnetic properties of Co-Cu multilayers

Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening

Interface-mediated Structural Evolution of Immiscible Co-Cu Multilayers Upon Solid-State Reaction

Structural evolution of Ag-Cu nano-alloys confined between AlN nano-layers upon fast heating

Microstructural Control of the Interface Layer for Strength Enhancement of Dissimilar Al/Cu Joints Via Ni Addition During TIG Arc Brazing

The effects of interfaces stability on mechanical properties, thermal conductivity and helium irradiation of V/Cu nano-multilayer composite

Enhanced Hardness Via Interface Alloying in Nanoscale Cu/Al Multilayers

Interfacial chemistry in Al/CuO reactive nanomaterial and its role in exothermic reaction

Intermixing at Ni-N/Cu(001) Interface and Its Effects on the Magnetic Properties of Ni

In Situ Analysis of Multiphase Compounds at the Liquid Al-Solid Cu Interface: Formation Sequence, Growth Kinetics and Critical Thickness

Microstructure and Thermal Stability of Cusin Self-Aligned Layer in Advanced Copper Interconnect Multilayer Films

Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

In Situ Study of Heavy Ion Irradiation Response of Immiscible Cu/Fe Multilayers

Influence of interface on deformation compatibility of a heterogeneous Cu/Al nanoscale multilayer