Abstract:Dark silicon is the phenomenon that a fraction of many-core chip has to be turned off or run in a low-power state in order to maintain the safe chip temperature. System-level thermal management techniques normally map application on non-adjacent cores, while communication efficiency among these cores will be oppositely affected over conventional network-on-chip (NoC). Recently, SMART NoC architecture is proposed, enabling single-cycle multi-hop bypass channels to be built between distant cores at runtime, to reduce communication latency. However, communication efficiency of SMART NoC will be diminished by communication contention, which will in turn decrease system performance. In this paper, we first propose an Integer-Linear Programming (ILP) model to properly address communication problem, which generates the optimal solutions with the consideration of inter-processor communication. We further present a novel heuristic algorithm for task mapping in dark silicon many-core systems, called TopoMap, on top of SMART architecture, which can effectively solve communication contention problem in polynomial time. With fine-grained consideration of chip thermal reliability and inter-processor communication, presented approaches are able to control the reconfigurability of NoC communication topology in task mapping and scheduling. Thermal-safe system is guaranteed by physically decentralized active cores, and communication overhead is reduced by the minimized communication contention and maximized bypass routing. Performance evaluation on PARSEC shows the applicability and effectiveness of the proposed techniques, which achieve on average 42.5 and 32.4 percent improvement in communication and application performance, and 32.3 percent reduction in system energy consumption, compared with state-of-the-art techniques. TopoMap only introduces 1.8 percent performance difference compared to ILP model and is more scalable to large-size NoCs.

Hotspot Prevention Through Runtime Reconfiguration in Network-On-Chip

Power-and thermal-aware mapping for NoC under latency constraint

Temperature-Aware On-Chip Networks

Thermal Modeling, Characterization And Management Of On-Chip Networks

Thermal-aware Resource Usage Allocation

A Thermal-Aware Application Specific Routing Algorithm for Network-on-chip Design

HOPE: Hotspot Congestion Control for Clos Network on Chip

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Thermal-aware application mapping using genetic and fuzzy logic techniques for minimizing temperature in three-dimensional network-on-chip

Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

System-Level Analysis of 3D ICs with Thermal TSVs

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Thermal-Aware Task Mapping on Dynamically Reconfigurable Network-on-Chip Based Multiprocessor System-on-Chip

Temperature-aware microarchitecture

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

HotSpot : Visualizing dynamic power consumption in RTL designs

Selecting optimal parallel microchannel configurations for active hot spot mitigation of multicore microprocessors in real time

HCGM-based High-Efficiency Temperature Evaluation Scheme for NoCs

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits