Investigating the use of maleic acid instead of urea formaldehyde resin and its effect on the single-layer particleboard properties

Farhad Hosseinzadeh,Vahid Vaziri,Loya Jamalirad,Majid Mokaber-Esfahani

DOI: https://doi.org/10.1080/01694243.2024.2433117

IF: 2.431

2024-12-01

Journal of Adhesion Science and Technology

Abstract:The aim of this research is to replace the urea formaldehyde (UF) resin with maleic acid and evaluate its effect on the physical and mechanical properties of single-layer particleboard. Industrial wood particles and maleic acid were used as the raw material and adhesive, respectively. Maleic acid was utilized at four levels of 0, 10, 20 and 30% by weight. The boards were manufactured under pressing conditions of 180 °C for 10 min. For comparison, a control sample was produced using 10% UF resin without maleic acid. The board size and target density were 450 × 450 × 16 mm and 0.7 g cm −3 , respectively. The results showed that the strengths values of boards increased with increasing maleic acid content from 10 to 20 wt% and then slightly decreased. The control sample (10% UF resin) met the requirements of the European Standard for Type P1 boards. While, the boards bonded with 20 wt% maleic acid satisfied the requirements of the European Standard for Type P2 boards .The physical properties of the boards improved with increasing maleic acid content. Infrared (IR) spectral analysis confirmed the formation of ester bonds, suggesting a reaction between the carboxyl groups of maleic acid and the hydroxyl groups of the wood materials. In conclusion, 20% maleic acid content is effective in improving the physical and mechanical properties of particleboard.

materials science, multidisciplinary,engineering, chemical,mechanics