Mechanical Properties of Particleboard Based on Zein Adhesive

CHANG Rui,SHENG Kui-chuan,WANG Hai,CUI Xiang,SHEN Ying-ying
2009-01-01
Abstract:In order to utilize zein from residues of corn starch processing, and to develop an environmental friendly particleboard, effects of methylene dichloride, zein and the temperature of making glue on the mechanical properties of particleboard based on zein adhesive were investigated. The results show that when the volume percentage of methylene dichloride was increased from 10% to 50%, the values of mechanical properties of particleboard, such as modulus of rupture, modulus of elasticity, tensile strength and internal bond strength, were initially increased and then decreased. The optimal volume percentage was obtained about 20%. When the percentage of zein was increased from 20% to 40%, the values of mechanical properties of particleboard also showed initial increased and then decreased, the optimal percentage of zein was found about 30%. When the temperature of making glue increased from 25℃ to 65℃, the value of mechanical properties of particleboard decreased, so the optimal temperature was found 25℃. The results indicate that the mechanical properties of particleboard based on zein adhesive in this experimental condition achieved the requirements of the state standard GB 4897-2003.
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