Characterization of Sand and Dust Pollution Degradation Based on Sensitive Structure of Microelectromechanical System Flow Sensor

Jinchuan Chen,Xiao Wen,Qinwen Huang,Wanchun Ren,Ruiwen Liu,Chunhua He
DOI: https://doi.org/10.3390/mi15050574
IF: 3.4
2024-04-27
Micromachines
Abstract:The effect of sand and dust pollution on the sensitive structures of flow sensors in microelectromechanical systems (MEMS) is a hot issue in current MEMS reliability research. However, previous studies on sand and dust contamination have only searched for sensor accuracy degradation due to heat conduction in sand and dust cover and have yet to search for other failure-inducing factors. This paper aims to discover the other inducing factors for the accuracy failure of MEMS flow sensors under sand and dust pollution by using a combined model simulation and sample test method. The accuracy of a flow sensor is mainly reflected by the size of its thermistor, so in this study, the output value of the thermistor value was chosen as an electrical characterization parameter to verify the change in the sensor's accuracy side by side. The results show that after excluding the influence of heat conduction, when sand particles fall on the device, the mutual friction between the sand particles will produce an electrostatic current; through the principle of electrostatic dissipation into the thermistor, the principle of measurement leads to the resistance value becoming smaller, and when the sand dust is stationary for some time, the resistance value returns to the expected level. This finding provides theoretical guidance for finding failure-inducing factors in MEMS failure modes.
chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
What problem does this paper attempt to address?
The problem this paper attempts to address is the reliability of Micro-Electro-Mechanical Systems (MEMS) flow sensors in dusty environments. Specifically, the researchers focus on the impact of dust pollution on the sensitive structures of MEMS flow sensors, especially factors other than thermal conduction that lead to a decrease in sensor accuracy. Existing research mainly concentrates on the thermal conduction effects caused by dust coverage, but other potential failure factors have not been thoroughly explored. Therefore, this paper aims to identify other inducing factors for the accuracy degradation of MEMS flow sensors under dust pollution by combining model simulation and experimental testing. The research focuses include: 1. **Electrostatic Effects**: When dust particles fall on the device, friction between the particles generates electrostatic currents. These currents enter the thermistor through the principle of electrostatic dissipation, causing its resistance value to decrease. After a period of time, when the dust settles, the resistance value returns to the expected level. 2. **Impact of Particle Size and Relative Humidity**: The study investigates the impact of dust pollution on the electrical characteristics of MEMS devices under different particle sizes and relative humidity conditions. Through theoretical derivation and descriptive simulation, the mechanisms of these factors are elaborated in detail. Overall, this paper comprehensively analyzes the impact of dust pollution on MEMS flow sensors through experimental and simulation methods, providing theoretical guidance for understanding the failure modes of MEMS devices.