Abstract:Abstract MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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On the Efficacy of Through-Silicon-Via Inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

&Amp;#x0022;green&#x0022; On-chip Inductors in Three-Dimensional Integrated Circuits

System-level Design Consideration and Optimization of Through-Silicon-via Inductor.

Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

Through-silicon-via inductor: Is it real or just a fantasy?

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs

TSV inductor optimization and its design implication

Rolled‐up Nanotechnology: Materials Issue and Geometry Capability

A Novel Local-Dielectric-Thickening Technique for Performance Improvements of Spiral Inductors on Si Substrates

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

A Multi-Function Planar Inductor Based on 3D Printing and Its Optimization

Compact 3D Metal Collectors Enabled by Roll‐to‐Roll Nanoimprinting for Improving Capacitive Energy Storage (small Methods 4/2022)

Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Vertical Topologies of Miniature Multispiral Stacked Inductors

Analyses of Mechanically-Assembled 3D Spiral Mesostructures with Applications As Tunable Inductors

The simulation study of high-performance micro-inductors Based on MEMS 3D coils

Fabrication of High-Performance On-Chip Suspended Spiral Inductors by Micromachining and Electroless Copper Plating

Design, Simulation, and Characterization of Variable Inductor with Electrostatic Actuation Fabricated by Using Surface Micromachining Technology

High-Performance 3-D Silicon-Embedded Coupled Solenoid Inductors With Inserted Magnetic Core