Removal Rate Prediction of Multiway Material Data Using the Deep Learning Approach

Han Li,Wenhui Fan
DOI: https://doi.org/10.1145/3532213.3532216
2022-03-18
Abstract:Chemical Mechanical Polishing (CMP) process is one of the most critical process steps in advanced packaging manufacturing. The material removal rate (MRR) value, which affects polishing accuracy, can be predicted by data-driven method. There is no general study of predicting MRR value based on different deep learning neural networks. In this paper, multiway data are directly employed as the input of three types of deep learning neural network to predict MRR value. Afterwards, features extracted by deep learning neural network are applied as the input of ensemble machine learning model. The proposed approaches are verified by the public dataset in 2016 PHM Challenge. Experiments results show the deep learning neural networks outperform traditional machine learning model, and integration model between deep learning model and traditional machine learning model pursues better performance.
Computer Science
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