Planning and building of health care facilities in rural areas in view of climate, building material and building techniques.

M. Boeckler

Abstract:

What problem does this paper attempt to address?

Prediction of Material Removal Rate Using Phase Partition and Semi-supervised Regression

Chunpu Lv,Jingwei Huang,Huangang Wang,Tao Zhang

DOI: https://doi.org/10.1109/cac57257.2022.10055009

2022-01-01

Abstract:In the Chemical Mechanical Planarization (CMP) process, the Material Removal Rate (MRR) is an important indicator of polishing performance. However, MRR is difficult to be measured. Therefore, Virtual Metrology (VM) methods to predict MRR by process variables have become a hot topic. Conventional VM methods extract the global statistical characteristics of the CMP process, ignoring its multi-phase characteristics. Meanwhile, a large amount of wafer data lacking MRR annotation is discarded, resulting in information waste. In this paper, a novel semi-supervised VM method for MRR is proposed. Through the clustering of sampling points, the CMP process is divided into multiple phases, and phase features are extracted. Since the information of unlabeled wafer samples needs to be utilized, two evaluation metrics, the stability constraint, and the accuracy gain are proposed to evaluate the confidence of pseudo-labels. The samples with high confidence will be added to the labeled sample set. Finally, the MRR is predicted by a semi-supervised regression algorithm. The proposed method is validated on a PHM Data Challenge dataset. The experimental results show that the application of phase partition and semi-supervised method is helpful to improve the prediction performance of the model and reduce the prediction error. The prediction performance of the proposed method outperforms most existing methods in the case of significantly fewer labeled samples.
Material Removal Rate Prediction with Phase Sensitive Variables Selection and Phase Partition

Chunpu Lv,Tao Zhang,Huangang Wang

DOI: https://doi.org/10.1109/icac55051.2022.9911149

2022-01-01

Abstract:In the Chemical Mechanical Planarization (CMP) process of the semiconductor industry, high accuracy prediction of Material Removal Rate (MRR) is essential to achieve wafer-to-wafer (W2W) control. Therefore, data-driven Virtual Metrology (VM) methods for MRR prediction have received much attention. Traditional methods focus on extracting features from raw data along the time dimension. However, a CMP process is a batch process with multi-phase and uneven-length characteristics, and different phases have different operating points and data correlations. In this paper, a novel VM method based on phase partition and feature selection is proposed. The phase-sensitive variables are selected by a wrapped approach and combined with a clustering algorithm for phase partition. After extracting the phase features, a suitable subset of features is selected using multiple feature selection methods and input to a regressor for prediction. The results in the PHM16 Dataset validate the effectiveness of the proposed method, which has higher prediction accuracy compared with the methods without phase partition.
Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

Wenlan Jiang,Chunpu Lv,Tao Zhang,Huangang Wang

DOI: https://doi.org/10.1007/978-3-030-93046-2_16

2021-01-01

Abstract:In semiconductor manufacturing, the average Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) process is important but difficult to measure. A useful method to predict MRR is to build a data-driven model for virtual metrology and a common step in virtual metrology is feature generation. However, few researches notice that the CMP process is a multi-phase batch process. Variable correlation varies with the phase variation. Thus, feature generation for the CMP process should consider the phase change to make the most of the process data. Inspired by this view, a phase partition-based virtual metrology method is proposed to predict MRR. In the proposed methodology, a novel phase partition and phase match method is first proposed to identify the stable phases in the batch process. And then statistical features are extracted from the time series of process variables and the filter-based feature selection method is designed to remove the irrelevant and redundant features. Based on the selected feature subset, a regression model is trained to predict the MRR. The effectiveness of the proposed method is evaluated on a challenge dataset.
Spatial Batch Optimal Design Based on Self-Learning Gaussian Process Models for LPCVD Processes

Pei Sun,Lei Xie,Junghui Chen

DOI: https://doi.org/10.1016/j.cjche.2015.11.013

IF: 3.8

2015-01-01

Chinese Journal of Chemical Engineering

Abstract:Low pressure chemical vapor deposition (LPCVD) is one of the most important processes during semiconductor manufacturing. However, the spatial distribution of internal temperature and extremely few samples makes it hard to build a good-quality model of this batch process. Besides, due to the properties of this process, the reliability of the model must be taken into consideration when optimizing the MVs. In this work, an optimal design strategy based on the self-learning Gaussian process model (GPM) is proposed to control this kind of spatial batch process. The GPM is utilized as the internal model to predict the thicknesses of thin films on all spatial-distributed wafers using the limited data. Unlike the conventional model based design, the uncertainties of predictions provided by GPM are taken into consideration to guide the optimal design of manipulated variables so that the designing can be more prudent. Besides, the GPM is also actively enhanced using as little data as possible based on the predictive uncertainties. The effectiveness of the proposed strategy is successfully demonstrated in an LPCVD process.
Deep Ensemble Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization with Pad Surface Topography

Jongmin Jeong,Yeongil Shin,Seunghun Jeong,Seonho Jeong,Haedo Jeong

DOI: https://doi.org/10.1016/j.precisioneng.2024.05.001

IF: 3.315

2024-05-04

Precision Engineering

Abstract:Chemical mechanical planarization (CMP) stands as a critical process in semiconductor manufacturing, necessitating precise prediction of material removal rate (MRR) to achieve optimal global planarization of material surface step heights. A notable hurdle in MRR prediction lies in the nonlinear pad-wafer interaction stemming from variations in the polishing pad surface. Despite numerous extant studies examining the asperity of the pad surface and the wafer-pad contact, aspects such as slurry lubrication and micro-topographical structure of the pad surface remain unaddressed. This study firstly proposes a deep ensemble learning-based approach for MRR prediction, leveraging the intricate interactions between the overall features of the pad surface and the polishing pressure. We experimentally generated diverse pad surfaces by controlling the process variables governing pad surface topography. The Multi-TabNet model, constructed by independently training multiple TabNet instances with distinct initialization and hyperparameters, furnishes a framework for MRR prediction across a broad spectrum of pad surface features, encompassing pores and cores. The results demonstrate a root mean square error of 80 Å/min, with the error margin reduced by up to 70% compared to predictions utilizing a single parameter of the pad surface. Furthermore, it exhibits an error improvement exceeding 17% relative to the existing method solely considering asperity. This study not only imparts insights for addressing MRR variations contingent on pad condition but also facilitates dependable material removal even on variable pad surfaces due to conditioner wear.

engineering, manufacturing,nanoscience & nanotechnology, multidisciplinary,instruments & instrumentation
Statistical Feature Extraction and Hybrid Feature Selection for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

Wenlan Jiang,Chunpu Lv,Bing Yang,Fuquan Zhang,Ying Gao,Tao Zhang,Huangang Wang

DOI: https://doi.org/10.1109/EDTM50988.2021.9421002

2021-01-01

Abstract:The prediction for average Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) process has been recognized to be critical for working condition identification in semiconductor manufacturing. This paper focuses on feature engineering in virtual metrology (VM) for MRR prediction. A statistical feature extraction method is proposed, and a two-step hybrid feature selection method is designed to select the relevant feature subset Enhanced performance is achieved on the PHM16 data set.
Virtual Metrology for Semiconductor Chemical Mechanical Planarization Process Using Wide & Deep Learning.

Fuzuo Zhang,Wenlan Jiang,Huan-gang Wang

DOI: https://doi.org/10.1145/3497623.3497679

2021-01-01

Abstract:Chemical mechanical planarization (CMP) is an important manufacturing procedure in semiconductor production. The average material remove rate (MRR) is a key indicator which could help engineers assess the process status. Thus, virtual metrology for MRR according to the machining process becomes a meaningful task. In this paper, a data-driven method based on the Wide & Deep neural network is proposed to predict MRR. We first extract candidate features from the time-series variables based on statistics and nearest neighbor information, and select the core feature subset for MRR prediction by filter and wrapper feature selection methods. And then Wide & Deep network is applied to learn the relationship between the selected features and the MRR. The proposed method is tested on a benchmark dataset from the 2016 PHM data challenge, and comparing to the existing methods, our algorithm obtains the best prediction performance on this dataset.
Reference-based Virtual Metrology method with uncertainty evaluation for Material Removal Rate prediction based on Gaussian Process Regression

Haoshu Cai,Jianshe Feng,Qibo Yang,Fei Li,Xiang Li,Jay Lee

DOI: https://doi.org/10.1007/s00170-021-07427-2

IF: 3.563

2021-06-29

The International Journal of Advanced Manufacturing Technology

Abstract:The prediction of average Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) process is regarded as a crucial research objective of Virtual Metrology (VM) for semiconductor manufacturing. In this paper, a novel VM model is proposed to predict MRR in CMP process based on the integration of Gaussian Process Regression (GPR) with a reference-based strategy. The proposed method estimates the similarity of the changing trends of the sensor traces using Maximum Mean Discrepancy (MMD) as a metric to extract reliable references for further prediction. The temporal information is also combined in the strategy by filtering the data samples by timestamps. Afterwards, GPR is used to fuse the reference data samples to predict the metrology with a confidence interval. Compared with the benchmarks in the recent literature, the proposed method, referred as MMD-GPR model, gives better prediction performance than ensemble learning methods and equivalent accuracy compared with Deep Neural Networks (DNN) but with a more efficient framework.

engineering, manufacturing,automation & control systems
A novel hypergraph convolution network-based approach for predicting the material removal rate in chemical mechanical planarization

Liqiao Xia,Pai Zheng,Xiao Huang,Chao Liu

DOI: https://doi.org/10.1007/s10845-021-01784-1

IF: 8.3

2021-05-24

Journal of Intelligent Manufacturing

Abstract:The material removal rate (MRR) plays a critical role in the chemical mechanical planarization (CMP) process in the semiconductor industry. Many physics-based and data-driven approaches have been proposed to-date to predict the MRR. Nevertheless, most of them neglect the underlying equipment structure containing essential interaction mechanisms among different components. To fill the gap, this paper proposes a novel hypergraph convolution network (HGCN) based approach for predicting MRR in the CMP process. The main contributions include: (1) a generic hypergraph model to represent the interrelationships of complex equipment; and (2) a temporal-based prediction approach to learn the complex data correlation and high-order representation based on the hypergraph. To validate the effectiveness of the proposed approach, a case study is conducted by comparing with other cutting-edge models, of which it outperforms in several metrics. It is envisioned that this research can also bring insightful knowledge to similar scenarios in the manufacturing process.

engineering, manufacturing,computer science, artificial intelligence
Predicting the Material Removal Rate in Chemical Mechanical Planarization Process: A Hypergraph Neural Network-Based Approach

Liqiao Xia,Pai Zheng,Chao Liu

DOI: https://doi.org/10.1115/detc2021-68250

2021-08-17

Abstract:Abstract Material removal rate (MRR) plays a critical role in the operation of chemical mechanical planarization (CMP) process in the semiconductor industry. To date, many physics-based and data-driven approaches have been proposed to predict the MRR. Nevertheless, most of the existing methodologies neglect the potential source of its well-organized and underlying equipment structure containing interaction mechanisms among different components. To address its limitation, this paper proposes a novel hypergraph neural network-based approach for predicting the MRR in CMP. Two main scientific contributions are presented in this work: 1) establishing a generic modeling technique to construct the complex equipment knowledge graph with a hypergraph form base on the comprehensive understanding and analysis of equipment structure and mechanism, and 2) proposing a novel prediction method by combining the Recurrent Neural Network based model and the Hypergraph Neural Network to learn the complex data correlation and high-order representation base on the Spatio-temporal equipment hypergraph. To validate the proposed approach, a case study is conducted based on an open-source dataset. The experimental results prove that the proposed model can capture the hidden data correlation effectively. It is also envisioned that the proposed approach has great potentials to be applied in other similar smart manufacturing scenarios.
Prediction of material removal rate in chemical mechanical polishing via residual convolutional neural network

Jiusi Zhang,Yuchen Jiang,Hao Luo,Shen Yin

DOI: https://doi.org/10.1016/j.conengprac.2020.104673

IF: 4.057

2021-02-01

Control Engineering Practice

Abstract:Chemical mechanical polishing (CMP) is one of the most powerful technologies to achieve global planarization for precision machining of the wafer surface. CMP contributes to intelligent manufacturing in Industry 4.0. Prediction of the material removal rate (MRR) is of vital significance for product quality control during the CMP process. There is no generally accepted theory to expound the principle of material removal in CMP. This paper proposes data-driven approaches to predict MRR based on deep learning methods to pursue better prediction performance. Random forest is employed to obtain the process variables which have a significant influence on MRR prediction and act as the input of the neural network. In addition, it is firstly proposed to predict MRR with the aid of residual convolutional neural network (ResCNN). The dataset provided by the PHM2016 Data Challenge is applied to compare the MRR prediction performance of the ResCNN with the CNN-based approach. Experimental results show that the prediction performance of ResCNN outperforms all the existing approaches reported in the literature.

automation & control systems,engineering, electrical & electronic
Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process

Ki Bum Lee,Chang Ouk Kim

DOI: https://doi.org/10.1007/s10845-018-1437-4

IF: 8.3

2018-07-17

Journal of Intelligent Manufacturing

Abstract:In semiconductor manufacturing, the chemical mechanical planarization (CMP) process produces higher thickness variability in the edge area of the wafer than that in the center area due to the characteristics of the polishing operation. To address this problem, advanced CMP equipment includes a function that controls the removal rate of each area. However, to take full advantage of this capability, effective advanced process control systems must be implemented with a virtual metrology (VM) model. However, the prediction performance of the VM model often deteriorates due to process drift. Here, we present a deep learning-based VM model that demonstrates high performance in the presence of nonlinear process drift. The proposed model combines a recurrent neural network and a convolutional neural network to extract time-dependent and time-independent features. A two-stage model training method is proposed that alternately updates the weights of each network to improve prediction performance. In the experiments using on-site CMP process data, the performance of the deep learning models exceeded that of standard machine learning models. The proposed model showed an 8.48% decrease in process variability relative to the best-performing machine learning model, which was elastic nets.

engineering, manufacturing,computer science, artificial intelligence
Semi-Supervised Hybrid Local Kernel Regression for Soft Sensor Modelling of Rubber-Mixing Process

Haiqing Yu,Jun Ji,Ping Li,Fengjing Shao,Shunyao Wu,Yi Sui,Shujing Li,Fengjiao He,Jhuning Liu

DOI: https://doi.org/10.1155/2020/6981302

IF: 2.5022

2020-01-01

Advances in Polymer Technology

Abstract:Soft sensor techniques have been widely adopted in chemical industry to estimate important indices that cannot be online measured by hardware sensors. Unfortunately, due to the instinct time-variation, the small-sample condition and the uncertainty caused by the drifting of raw materials, it is exceedingly difficult to model the fed-batch processes, for instance, rubber internal mixing processing. Meanwhile, traditional global learning algorithms suffer from the outdated samples while online learning algorithms lack practicality since too many labelled samples of current batch are required to build the soft sensor. In this paper, semi-supervised hybrid local kernel regression (SHLKR) is presented to leverage both historical and online samples to semi-supervised model the soft sensor using proposed time-windows series. Moreover, the recursive formulas are deduced to improve its adaptability and feasibility. Additionally, the rubber Mooney soft sensor of internal mixing processing is implemented using real onsite data to validate proposed method. Compared with classical algorithms, the performance of SHLKR is evaluated and the contribution of unlabelled samples is discussed.
Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process

Yunsong Xie,Ryan Stearrett

DOI: https://doi.org/10.48550/arXiv.2107.05071

2021-07-28

Abstract:A cross-benchmark has been done on three critical aspects, data imputing, feature selection and regression algorithms, for machine learning based chemical vapor deposition (CVD) virtual metrology (VM). The result reveals that linear feature selection regression algorithm would extensively under-fit the VM data. Data imputing is also necessary to achieve a higher prediction accuracy as the data availability is only ~70% when optimal accuracy is obtained. This work suggests a nonlinear feature selection and regression algorithm combined with nearest data imputing algorithm would provide a prediction accuracy as high as 0.7. This would lead to 70% reduced CVD processing variation, which is believed to will lead to reduced frequency of physical metrology as well as more reliable mass-produced wafer with improved quality.

Machine Learning,Artificial Intelligence
Adaptive Local Kernel-Based Learning for Soft Sensor Modeling of Nonlinear Processes

Kun Chen,Jun Ji,Haiqing Wang,Yi Liu,Zhihuan Song

DOI: https://doi.org/10.1016/j.cherd.2011.01.032

IF: 7.8

2011-01-01

Process Safety and Environmental Protection

Abstract:Soft sensor techniques have been widely used to estimate product quality or other key indices which cannot be measured online by hardware sensors. Unfortunately, their estimation performance would deteriorate under certain circumstances, e.g., the change of the process characteristics, especially for global learning approaches. Meanwhile, local learning methods always only utilize input information to select relevant instances, which may lead to a waste of output information and inaccurate sample selection. To overcome these disadvantages, a new local modeling algorithm, adaptive local kernel-based learning scheme (ALKL) is proposed. First, a new similarity measurement using both input and output information is proposed and utilized in a supervised locality preserving projection technique to select relevant samples. Second, an adaptive weighted least squares support vector regression (AW-LSSVR) is employed to establish a local model and predict output indices for each query data. In AW-LSSVR, instead of using traditional cross-validation methods, the trade-off parameters are adjusted iteratively and the local model is updated recursively, which reduces the computational complexity a lot. The proposed ALKL is applied to an online crude oil endpoint prediction in an industrial fluidized catalytic cracking unit (FCCU) process. The experimental results demonstrate the high precision of our ALKL approach.
Adaptive least contribution elimination kernel learning approach for rubber mixing soft-sensing modeling

Yanchen Gao,Jun Ji,HaiQing Wang,Ping Li

DOI: https://doi.org/10.1109/ICICISYS.2010.5658479

2010-01-01

Abstract:Rubber mixing process is a typical non-linear fed-batch process without well developed mechanism. Soft-sensing modeling of the mixture's Mooney viscosity is crucial and challenging since this index is an important process criterion to judge the quality of rubber compounds while the measurement of Mooney viscosity is time-consuming and laborious to assay. Furthermore, the mixing process is drifting and volatile even noisy; only few data samples could be used to modeling. In present paper, an adaptive least contribution elimination kernel learning (ALCEKL) approach is proposed to predict the Mooney viscosity. It adopts a sparsity strategy of least contribution elimination and presents a buffer based learning algorithm associated with improved space angle index (SAI) strategy. Experiments on field data indicate that proposed approach is more robust and accurate than other kernelized modeling methods with feasible computational complexity under field circumstances.
Semi-Supervised Deep Dynamic Probabilistic Latent Variable Model for Multimode Process Soft Sensor Application

Le Yao,Bingbing Shen,Linlin Cui,Junhua Zheng,Zhiqiang Ge

DOI: https://doi.org/10.1109/tii.2022.3183211

IF: 12.3

2023-01-01

IEEE Transactions on Industrial Informatics

Abstract:Nonlinear and multimode characteristics commonly appear in modern industrial process data with increasing complexity and dynamics, which have brought challenges to soft sensor modeling. To solve these issues, in this article, a dynamic mixture variational autoencoder regression model is first proposed to handle the multimode industrial process modeling with dynamic features. Furthermore, to deal with the partially labeled process data with rare quality values and large-scale unlabeled samples, a semi-supervised mixture variational autoencoder regression model is proposed, where a corresponding semi-supervised data sequence division scheme is introduced to make full use of the information in both labeled and unlabeled data. Finally, to verify the feasibility and effectiveness of the proposed methods, the models are applied to a numerical case and a methanation furnace case. The results show that the proposed methods have superior soft sensing performance, compared with the state-of-the-art methods.
A Machine Learning Approach Capturing Hidden Parameters in Autonomous Thin-Film Deposition

Yuanlong Zheng,Connor Blake,Layla Mravac,Fengxue Zhang,Yuxin Chen,Shuolong Yang

2024-11-28

Abstract:The integration of machine learning and robotics into thin film deposition is transforming material discovery and optimization. However, challenges remain in achieving a fully autonomous cycle of deposition, characterization, and decision-making. Additionally, the inherent sensitivity of thin film growth to hidden parameters such as substrate conditions and chamber conditions can compromise the performance of machine learning models. In this work, we demonstrate a fully autonomous physical vapor deposition system that combines in-situ optical spectroscopy, a high-throughput robotic sample handling system, and Gaussian Process Regression models. By employing a calibration layer to account for hidden parameter variations and an active learning algorithm to optimize the exploration of the parameter space, the system fabricates silver thin films with optical reflected power ratios within 2.5% of the target in an average of 2.3 attempts. This approach significantly reduces the time and labor required for thin film deposition, showcasing the potential of machine learning-driven automation in accelerating material development.

Materials Science,Robotics
Material Removal Rate Prediction for Sapphire Double-Sided CMP Based on RSM-SVM

Zhongyang Li,Zhaohui Deng,Jimin Ge,Rongjin Zhuo,Linlin Wan

DOI: https://doi.org/10.1149/2162-8777/ac8371

IF: 2.2

2022-07-24

ECS Journal of Solid State Science and Technology

Abstract:As a crucial substrate material for optoelectronic materials, sapphire has important applications in both military and civilian fields. In order to achieve the final processing quality of sapphire substrate materials, double-sided chemical mechanical polishing (DS-CMP) is a necessary process, which is also a guarantee for the preparation of high-end LED chips. Here, the sapphire DS-CMP processing plan based on the Box-Behnken design is obtained and experimented, then a hybrid approach of response surface method (RSM) and support vector machines (SVM) algorithm is established as the material removal rate (MRR) prediction model for sapphire DS-CMP. Furthermore, the material removal process of sapphire DS-CMP, the influence of response variables on the MRR of sapphire DS-CMP, and the prediction results of RSM-SVM on sapphire DS-CMP are analyzed respectively. From the experimental results, the maximum MRR obtained is 387.59 nm/min, which is more than six times the reported MRR of single-sided CMP under similar process parameters. The mean square error of predicted value through RSM-SVM is basically around ±10% of the experimental value, which possess satisfied validity for the MRR prediction of sapphire DS-CMP. Finally, both top and bottom surface quality of sapphire wafers after DS-CMP processing was investigated.

materials science, multidisciplinary,physics, applied
Quantifying the CVD-grown Two-Dimensional Materials Via Image Clustering.

Zebin Li,Jihea Lee,Fei Yao,Hongyue Sun

DOI: https://doi.org/10.1039/d1nr03802h

IF: 6.7

2021-01-01

Nanoscale

Abstract:Machine learning (ML) techniques have been recently employed to facilitate the development of novel two-dimensional (2D) materials. Among various synthesis approaches, chemical vapor deposition (CVD) has demonstrated tremendous potential in producing high-quality 2D flakes with good controllability, enabling large-scale production at a relatively low cost. Traditionally, the quality of CVD-grown samples can be manually evaluated based on optical images which is labor-intensive and time-consuming. In this paper, we explored a data-driven unsupervised quality assessment strategy based on image clustering via integrating self-organizing map (SOM) and k-means methods for optical image analysis of CVD-grown 2D materials(.) The high matching rate between the clustering results and material experts' labels indicated a good accuracy of the proposed clustering algorithm. The proposed unsupervised ML methodology will provide materials scientists with an effective tool kit for efficient evaluation of CVD-grown materials' quality and has a broad applicability for various material systems.

Planning and building of health care facilities in rural areas in view of climate, building material and building techniques.

Prediction of Material Removal Rate Using Phase Partition and Semi-supervised Regression

Material Removal Rate Prediction with Phase Sensitive Variables Selection and Phase Partition

Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

Spatial Batch Optimal Design Based on Self-Learning Gaussian Process Models for LPCVD Processes

Deep Ensemble Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization with Pad Surface Topography

Statistical Feature Extraction and Hybrid Feature Selection for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

Virtual Metrology for Semiconductor Chemical Mechanical Planarization Process Using Wide & Deep Learning.

Reference-based Virtual Metrology method with uncertainty evaluation for Material Removal Rate prediction based on Gaussian Process Regression

A novel hypergraph convolution network-based approach for predicting the material removal rate in chemical mechanical planarization

Predicting the Material Removal Rate in Chemical Mechanical Planarization Process: A Hypergraph Neural Network-Based Approach

Prediction of material removal rate in chemical mechanical polishing via residual convolutional neural network

Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process

Semi-Supervised Hybrid Local Kernel Regression for Soft Sensor Modelling of Rubber-Mixing Process

Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process

Adaptive Local Kernel-Based Learning for Soft Sensor Modeling of Nonlinear Processes

Adaptive least contribution elimination kernel learning approach for rubber mixing soft-sensing modeling

Semi-Supervised Deep Dynamic Probabilistic Latent Variable Model for Multimode Process Soft Sensor Application

A Machine Learning Approach Capturing Hidden Parameters in Autonomous Thin-Film Deposition

Material Removal Rate Prediction for Sapphire Double-Sided CMP Based on RSM-SVM

Quantifying the CVD-grown Two-Dimensional Materials Via Image Clustering.