A Microscopic Mechanics Model for Thermal Fatigue Crack Growth

Yi Sun,Rui Zhang,Jun Ma

DOI: https://doi.org/10.4028/www.scientific.net/KEM.274-276.205

2004-08-30

Abstract:Many engineering components, such as steam turbine rotor system, outer shell of nuclear reactors, or even solder connection in electronic packing, are prone to thermal fatigue under service conditions. As their working temperatures are relatively high, they may also endure creep damage [1]. The thermal fatigue is a very important and very complicated problem in the engineering field. In earlier studies [2-7], the effect of various testing conditions on the isothermal, thermal-mechanical fatigue and thermal-mechanical creep-fatigue behavior of typical materials was investigated, but the microscopic mechanical model of creep-fatigue is not quite clear. Until now the most common way to treat the problem is to make a simple linear superposition of the individual effect. In the present work, an analytical micromechanics model is proposed to describe the influence and interaction of fatigue and creep. Here, a recently proposed fatigue crack growth model is adopted [8] which views the fatigue crack growth process as the intermissive elastic cleavage fracture of the dislocation free zone (DFZ). The effect of cyclic loading makes the plastic zone hardening (or softening), which raises the stress level in DFZ and leads to fracture. The calculated dN dc / curves exhibit three different stages of fatigue crack growth that is in general agreement with the experimental observations.

Materials Science