Abstract:The rapid advancement of micro-nano machining technology has led to a decrease in the dimensions of microdevices and microchips, following the principles of Moore's law. In addition to conventional semiconductor materials like silicon, emerging nanoscale materials such as nanowires, nanotubes, and two-dimensional materials are being considered as promising alternative constituent materials. The mechanical properties of these materials have a significant impact on the performance and service life of these microdevices and microchips. However, conventional mechanical testing methods have difficulty in accurately measuring the properties of these materials at the nanoscale due to limitations in displacement control and microforce sensing. Consequently, there is an urgent need to develop a micromechanical device capable of testing nanoscale solid materials. In this study, we propose a concept based on high-resolution image sequences for the design of an integrated micromechanical device capable of synchronously measuring the force and deformation of tested specimens. The device has been fabricated using ultrafast femtosecond laser etching technology, which offers an efficient and cost-effective approach for manufacturing microstructures and is suitable for processing various materials such as metals and nonmetals. The stiffness of the device plays a crucial role in the design of the micromechanical device, and a stiffness-matching criterion is introduced to ensure appropriate design parameters. The fabricated device is employed to conduct in-situ tension experiments on SiC nanowires and multilayer molybdenum disulfide nanosheet within a scanning electronic microscope, enabling accurate measurement of their strength, modulus, and fracture strain.

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Measurement of Stress-strain Curves of PECVD Silicon Oxide Thin Films by Means of Nanoindentation

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MICROBRIDGE TESTING OF YOUNG＇S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

Thickness-dependent Structural Relaxation of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Films during Thermal Processing

New Methods for Measuring Mechanical Properties of Thin Films in Micromachining: Beam Pull-in Voltage (VPI) Method and Long Beam Deflection (LBD) Method