Frequency domain analysis of magnetic field images obtained using TMR array sensors for subsurface defect detection and quantification

Chaofeng Ye,Yang Wang,Meiling Wang,Lalita Udpa,Satish S. Udpa
DOI: https://doi.org/10.1016/j.ndteint.2020.102284
2020-12-01
Abstract:<p>Quantitative characterization of subsurface defects is a challenging problem in eddy current testing (ECT), not only due to the limitation of the penetration depth of eddy currents, but also due to the ill-posed nature of the inverse problem associated with quantifying a defect's 3D dimensions and its location in the test sample from measurements made on the sample surface. This paper presents a new ECT method for subsurface defect detection and quantification. Eddy currents with continuously varying frequency in a selected frequency band is induced in the conductive sample by using a chirp modulated excitation scheme. The frequency band of the chirp waveform is chosen so that the penetration depth of eddy current in the selected frequency band covers the thickness of the sample under test. The presence of a defect will disturb the distribution of the induced eddy currents. This disturbance is measured in terms of a varying magnetic field using an array of tunneling magneto-resistance (TMR) sensors. A C-scan image is obtained by linearly scanning the specimen. The footprint of the defect is calculated using spatial features of the C-scan image while the depth of the defect is estimated by analyzing the frequency characteristics of the measured chirp signal. A three-dimensional estimate of the dimensions of any subsurface defect can be obtained using the empirical procedure. The operating principle of this method is studied with a finite element method (FEM) model and then validated experimentally with a prototype array probe consisting of 180 TMR sensors. Thanks to its high sensitivity, the TMR sensors are suitable for measuring the weak low frequency magnetic field signal caused by a deep defect. The spacing between each two adjacent sensors is as small as 0.5 mm providing a magnetic field image with fine spatial resolution, which is beneficial for defect quantification. An aluminum sample with embedded defects was tested using the prototype probe. It is seen that the proposed scheme utilizing spatial and frequency domain features is capable of quantitatively characterizing subsurface defects.</p>
materials science, characterization & testing
What problem does this paper attempt to address?
This paper aims to solve the problem of quantitative characterization of deep - layer defects in Eddy Current Testing (ECT). Specifically, ECT is very effective in detecting surface or near - surface defects in conductive materials and structures. However, when the target defect is located deep within the metal structure, due to the limited penetration depth of eddy currents and the ill - posed nature of the inverse problem of back - calculating the three - dimensional size and position of the defect from the measurement data on the sample surface, it becomes extremely challenging to detect deep - layer defects using ECT. To solve these problems, the paper proposes a new ECT method for the detection and quantification of deep - layer defects. The main innovations of this method include: 1. **Modulated excitation signal**: Use a linear frequency - modulated (Chirp) excitation scheme with continuously changing frequencies to induce eddy currents in the conductive sample within the selected frequency band. The selected frequency band range can cover the thickness of the sample to be tested, thereby ensuring that the energy of the eddy currents is concentrated within the depth range of interest. 2. **High - sensitivity magnetic sensor array**: Employ a Tunnel Magnetoresistance (TMR) sensor array to measure the magnetic field changes caused by the defect. TMR sensors have the characteristics of high sensitivity and small size, and can provide a magnetic field image with high spatial resolution, which is beneficial for the quantitative analysis of the defect. 3. **Frequency - domain analysis**: Analyze the frequency characteristics of the measured Chirp signal and combine the spatial characteristics of the C - scan image to estimate the position and depth of the defect, thereby achieving the three - dimensional size estimation of the deep - layer defect. The paper studies the working principle of this method through a Finite Element Method (FEM) model and verifies its feasibility through experiments. The experimental results show that the proposed method using spatial and frequency - domain characteristics can quantitatively characterize deep - layer defects.