Methods and strategies to decrease the dielectric properties of polyimide films: a review

Dongyang Zhang,Linling Li,Yong Wang,Chen Zhang,Chao Teng
DOI: https://doi.org/10.1007/s10971-023-06143-5
2023-07-07
Journal of Sol-Gel Science and Technology
Abstract:Polyimide films with low dielectric properties and high thermal stability have been widely used in advanced integrate circuit industry. Herein, this article briefly summarized the recent achievements in reducing the dielectric properties of polyimide films via a variety of methods or strategies, and the mechanical properties, thermal stability or optical properties were also summarized. Achieving the synergy of low dielectric properties, high thermal stability and superior mechanical properties is the research directions and priories of future development for polyimide films.
materials science, ceramics
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