Effects of temperature on reaction path, spreading and wetting mechanism of Cu–20Sn–2Cr/graphite

Wenjuan Ci,Yu Shi,Qiaoli Lin,Yufen Gu,Guang Li
DOI: https://doi.org/10.1016/j.ceramint.2023.09.021
IF: 5.532
2023-10-06
Ceramics International
Abstract:The non-wetting of the carbon/copper interface makes the conventional hot-pressing preparation process of copper-impregnated graphite (CIG) composites complex, energy-consuming, and costly. Pressureless infiltration can be achieved by the simultaneous addition of low melting point alloying elements and active elements to the Cu matrix. Given the strong dependence of this process on temperature, a modified sessile drop method was used to investigate the reaction path, spreading and wetting mechanisms of Cu–20Sn–2Cr/graphite system under vacuum at 800–1100 °C. The results showed that the equilibrium contact angle θ e decreased from 38° (800 °C) to 14° (1100 °C), mainly because the microstructure and distribution of the reaction product layer (RPL) were transformed from an in-compact and discontinuous layer composed of irregular Cr 3 C 2 particles to a dense and continuous layer composed of regular nanospheres or nanorod-like Cr 7 C 3 particles. In addition, the spreading mechanism was controlled by the local reaction of [Cr] and [C] atoms at the triple line (TL) at 800 °C, and by the diffusion of [Cr] atoms to the front of TL at 900–1100 °C. The wetting experiment of the Cu–20Sn–2Cr alloy on the Cr 7 C 3 substrate prepared in situ verified that the Cu–20Sn–2Cr/C gr system followed the reaction product controlled (RPC) wettability theory.
materials science, ceramics
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