Effect of Mo content on interfacial microstructure and properties of explosive welded Mo–Cu/Cu plates

Yong Wei,Ze-Rui Xie,Xian-Jun Wu,Tong Liu,Zheng-Dao Li
DOI: https://doi.org/10.1016/j.jmrt.2023.10.097
IF: 6.267
2023-10-14
Journal of Materials Research and Technology
Abstract:In this study, Mo-Cu/Cu plates were successfully fabricated by explosive welding and the influence of Mo content on their interfacial microstructure, shear strength, thermal conductivity and electrical conductivity was investigated. The results showed that as the Mo content increased to 70 wt%, the number of serrations at the interface of the Mo 70 Cu 30 /Cu plate increased, exhibiting a more complete shape and periodically ordered arrangement. In addition, increasing the Mo content to 70 wt% leads to a significant improvement in the interdiffusion distance at the interface, resulting in significant improvements in shear strength, thermal conductivity and electrical conductivity compared to the corresponding Mo 70 Cu 30 plate. More serrations, more complete serrations and periodically arranged serrations benefit from increased Mo content to 70 wt% while improving the shear strength, thermal conductivity and electrical conductivity compared to raw material of Mo–Cu plate.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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