Abstract:A site-specific xenon plasma focused ion beam preparation technique for microcantilever samples (1-20 µm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift-out onto a clean silicon wafer to facilitate easy access of a low-cost probe type indenter which provides bending force measurement. The lift-out method allows sufficient room for the indenter and a line of sight for the electron beam to enable displacement measurement. An electroplated nanotwinned copper (NTC) was cut to a 3 × 3 × 25 µm microbeam and in situ mechanically tested using the developed technique. It demonstrated measured values of Youngs modulus of 78.7 ± 11 GPa and flow stress of 0.80 ± 0.05 GPa, which is within the ranges reported in the literature. LAY DESCRIPTION: In this paper a site specific method is present for making particularly small mechanical tests samples, of the order of 100th the size of a human hair. These small samples can then be used to determine the mechanical properties of the bulk material. Copper with a nano twinned grain structure is used as a test medium. Ion milling was used to cut the sample to shape and a micro probe was used for mechanical testing. Ion milling can cut away very small volumes of material as it accelerates ions at the surface of the sample, atomically machining the sample. Micro probes are a cost-effective small-scale load measurement devices, however, they require a large area for accessing the sample. The indenter requirements are a problem when making you samples with ion milling as ion millers are best at making small cuts. Our aim was to design a cutting strategy which reduces the amount of cutting required while allowing samples to be fabricated anywhere on the sample. We used a chunk lift out technique to remove a piece of material which is then welded to a wafer of silicon this gives sufficient space around the sample for ion milling and testing. The additional space allowed easy access for the probe. A 3 × 3 × 10 µm micro cantilever beam was cut out from copper, this beam was then bent. The force from bending and distance bent was measured and converted into Youngs modulus which is a measure of flexibility. The modulus value measured was comparable to the values reported in other papers.

Mechanical properties of micro-sized copper bending beams machined by the focused ion beam technique

Mechanical Property Evaluation on the Bending and Compressing Behaviour of Nano-Beam

Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Bending Stress Relaxation of Microscale Single-Crystal Copper at Room Temperature: an in Situ SEM Study

Micro-cantilever bending tests for understanding size effect in gradient elasticity

Elastic size effect of single crystal copper beams under combined loading of torsion and bending

Effects of size on the mechanical response of metallic glasses investigated through in situ TEM bending and compression experiments

In Situ TEM Investigation of the Mechanical Behavior of Micronanoscaled Metal Pillars

Size Effect Affected Mechanical Properties and Formability in Micro Plane Strain Deformation Process of Pure Nickel

The Strain Hardening of Micro-Sized Face-Centered-cubic Single Crystal Metals: A Crystal Plasticity Study

Dimension effect on mechanical behavior of silicon micro-cantilever beams

Experimental and Numerical Studies of Coupling Size Effects on Material Behaviors of Polycrystalline Metallic Foils in Microscale Plastic Deformation

Deformation of Small-Volume Al-4Cu Alloy under Electron Beam Irradiation

Simulation of Scale Dependency on Tensile Mechanical Properties of Single Crystal Copper Nano-Rod

Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system

Dose and energy dependence of mechanical properties of focused electron beam induced pillar deposits from Cu(C5HF6O2)2

Strain hardening in bent copper foils

Size effects and the deformation behaviour of a dilute Mg-Zn-Ca alloy subjected to cyclic four-point bending

Transition from Homogeneous-Like to Shear-Band Deformation in Nanolayered Crystalline Cu/amorphous Cu–Zr Micropillars: Intrinsic Vs. Extrinsic Size Effect

THE DEEP LINK BETWEEN FCC AND BCC METALS