Abstract:As the next generation of die attachment technology, sintering bonding using silver nanoparticles is attracting great interest for application in power electronics packaging. For organic-free silver nano-sintering materials, increasing the oxygen content facilitates the sintering process but also causes oxidation of the substrate and other components. In this work, organic-free silver nanostructured film was utilized to bond the SiC chips and the substrate with three types of metallization: (1) electroless nickel immersion gold finishing substrate (ENIG), (2) Ag-coated substrate, and (3) bare Cu substrate. The bonding process was conducted at low temperature (150–300°C), and the effects of oxygen on the microstructure, bonding quality of the interfaces and fracture morphology were studied. Oxygen significantly facilitated the sintering process of the Ag nanoparticles in the film, which promoted the densification of the bondline, even at low concentrations (0.05%). In addition, the facilitating effects of oxygen were detected at content of 0.05% during the sintering between Ag nanoparticles and the three types of metallized substrate. However, at higher oxygen content (≥5%), the sintering behavior varied among the different substrate metals. The Ag-coated substrate surface roughened in situ at high oxygen content and showed positive effects on the bonding strength, while the ENIG substrate surface was inert to oxygen. The bare Cu substrate surface showed complex oxide states at different oxygen concentrations. The Cu 2 O phase formed at oxygen content of ≤ 5%, which enhanced the bonding strength, while CuO tended to appear at oxygen content of ≥ 20%, which reduced the bonding strength. These results reveal that relatively low oxygen content (0.05%) can effectively improve bonding strength while avoiding oxidation of the Cu substrate.

Oxygen Impurity-Tuned Structure and Adhesion Properties of the Cu/SiO 2 Interface

Oxygen Impurity-Tuned Structure and Adhesion Properties of the Cu/SiO2 Interface.

The Atomic Structure and Electronic States of Oxygen- Adsorbed on Cu(110)c(2×1) Surface

First-principles study of adhesion at Cu/SiO$_2$ interfaces

Tuning the Activities of Cu2O Nanostructures via the Oxide-Metal Interaction

The invisible hand of pre-adsorbates: Unveiling oxygen's role in sculpting Cu-TiN interfaces

Tuning the Activities of Cuprous Oxide Nanostructures Via the Oxide-Metal Interaction

Adhesion Properties of Cu(111)/α-quartz (0001) Interfaces: A Molecular Dynamics Study

Oxygen Vacancy-Laden Confinement Impact on Degradation of Metal Complexes

Microscopic characterization and interfacial properties of the Ag/CuO interface: Structure and binding properties of the interface based on first-principles calculations

A First-Principles Investigation of Interfacial Properties and Electronic Structure of SiO2/Al Interface

Interface-level thermodynamic stability diagram for in situ internal oxidation of Ag(SnO2)p composites

Oxygen Impurity Effects on the Mechanical Properties of SiC Studied by First Principles Calculations

Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization

Engineering unsymmetrically coordinated Cu-S1N3 single atom sites with enhanced oxygen reduction activity

Molecular insight of the interface evolution of silicon carbide under hyperthermal atomic oxygen impact

Oxygen Manipulation at the Co/SiO 2 Interface and Its Effect on Spin-Dependent Transport Properties

Role of Interfaces in the Thermal Reduction Process of the FeO/Cu2O/Cu(100) Surface

Oxygen Vacancy Induced Structure Change and Interface Reaction in HfO2 Films on Native SiO2/Si Substrate

Identification of Interface Structure for a Topological CoS2 Single Crystal in Oxygen Evolution Reaction with High Intrinsic Reactivity.

The Role of Atomic Structures on the Oxygen Corrosion of Polycrystalline Copper Surface