Abstract:Metal-film dielectric capacitors provide lump portions of energy on demand. While the capacities of various capacitor designs are comparable in magnitude, their stabilities make a difference. Dielectric breakdowns - micro-discharges - routinely occur in capacitors due to the inevitable presence of localized structure defects. The application of polymeric dielectric materials featuring flexible structures helps obtain more uniform insulating layers. At the modern technological level, it is impossible to completely avoid micro-discharges upon device exploitation. Every micro-discharge results in the formation of a soot channel, which is empirically known to exhibit semiconductor behavior. Because of its capability to conduct electricity, the emerged soot channels harm the subsequent capacitor performance and decrease the amount of stored energy. The accumulation of the soot throughout a dielectric capacitor ultimately results in irreversible overall failure. In the context of the dielectric breakdown, self-healing designates a range of chemical processes, which spontaneously rearrange the atoms in the soot channels to partially return their insulative function. We developed a universal method capable of rating new capacitor designs including electrode and polymer material and their proportions. We found the best-performing designs produce abundant volatile by-products after micro-discharge, whereas the soot samples exhibit lower electronic conductivities. We proved the capability of the theoretical method to rate the empirical performance of the known capacitors. The method relies on various electronic-structure simulations and potential landscape explorations. The reported advance opens an impressive avenue to computationally probe thousands of hypothetical capacitor designs.

Self-Healing in Metallized Film Capacitors: Theory of Breakdown Interruption

Dynamic Process of Self-Healing in Metallized Film: from Experiment to Theoretical Model

Electrically Induced Heat Dissipation In Metallized Film Capacitors

Study of the in situ test setup and analysis methods for self-healing properties of metallized film capacitors

Theoretical and experimental studies on the self‐healing properties of metallised capacitor films under multiple stresses

Phase-field Modeling of Electric-Thermal Breakdown in Polymers under Alternating Voltage

Self-Healing in Dielectric Capacitors: a Universal Method to Computationally Rate Newly Introduced Energy Storage Designs

Heat Generation and Temperature Distribution in Dc Metallized Polymer Film Capacitors

Temporal Evolution of Electric Field Distribution and Energy Dissipation in a Metallized Polymer Film Capacitor under DC, AC or Nonsinusoidal Voltage Stresses

Self-healing Characteristics of Metallized Film Capacitor under DC and AC Superimposed Voltage with Harmonics

Surface Flashover Dynamics in Metallized Polymer Film Capacitors

Fully Kinetic Model Of Breakdown During Sheath Expansion After Interruption Of Vacuum Arcs

Impact of Surface Discharge Plasmas on Performance of a Metallized Film Capacitor

Study on the Structure–Function Relationship Between Metallized Layer and Self-Healing Morphology in Metallized Film

Reassessing Self-healing in Metallized Film Capacitors: A Focus on Safety and Damage Analysis

Phase-Field Modeling of Electromechanical Breakdown in Multilayer Ceramic Capacitors

Enthalpy‐Driven Self‐Healing in Thin Metallic Films on Flexible Substrates

Influence factors for the self-healing of metallized polypropylene capacitors

Phase‐Field Model of Electrothermal Breakdown in Flexible High‐Temperature Nanocomposites under Extreme Conditions

Self-healing Behaviors of Metallized High-Temperature Dielectric Films for Capacitor Applications

Model of Dielectric Breakdown in Hafnia-Based Ferroelectric Capacitors