Study on the Heat Dissipation Model and Simulation of Circular Element for DC-Link Capacitor

Qianglin Zuo,Qiaoshu Lei,Shaolong Zhong,Yongxin Zhang,Zhimin Dang
DOI: https://doi.org/10.1007/978-981-97-0869-7_65
2024-01-01
Abstract:With the continuous expansion of the application range of self-healing dry metallized film capacitor, its heat dissipation mode and internal temperature-rising have become important theoretical and engineering problems. In view of this, the paper is based on the heating rule of the cylindrical element of the DC-link capacitor. Furthermore, combined with the principle of electro-thermal duality, the thermal calculation model of the cylindrical element is established, and the thermal resistance calculation formula of a cylindrical element is obtained through the integration of the differential cells. Finally, the correctness of the thermal calculation model of cylindrical element is verified through the test, and the verification method of thermal calculation of cylindrical element is proposed, which will provide theoretical and experimental reference for the heating of cylindrical element of DC-link capacitor.
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